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PAPERS ON RELIABILITY

Validation of Electronic Package Reliability Using Speckle Interferometry

[+] Author and Article Information
H.-Y. Yeh, K. Cote

Mechanical Engineering Department, California State University, Long Beach, Long Beach, CA 90840

J. Electron. Packag 124(3), 277-280 (Jul 26, 2002) (4 pages) doi:10.1115/1.1478060 History: Received September 19, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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References

Figures

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Calculated strain in the package assembly due to thermal loading
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Fringe pattern from speckle pattern correlation between 125°C and 25°C
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Schematic of LGA test assembly
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Stress-strain curve of BT material at 25°C using both strain extensometer and ESPI to record strain values
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Typical phase map image from tensile testing, resulting y-displacement, and calculated Y-axis tensile strain
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Temperature dependent CTE results for BT resin materials

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