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PAPERS ON RELIABILITY

Validation of Electronic Package Reliability Using Speckle Interferometry

[+] Author and Article Information
H.-Y. Yeh, K. Cote

Mechanical Engineering Department, California State University, Long Beach, Long Beach, CA 90840

J. Electron. Packag 124(3), 277-280 (Jul 26, 2002) (4 pages) doi:10.1115/1.1478060 History: Received September 19, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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References

Stout,  E. A., , 2000, “Mechanical Characterization of Plastic Ball Grid Array Package Flexture Using Moire Interferometry,” IEEE Transactions on Advanced Packaging, 23(4), pp. 637–645.
Dadkhah, M. S. et al., 1999, “Strain Concentration Measurements in Ceramic Matrix Composites Using Speckle Interometry,” Proc. 8th Society of Experimental Mechanics Conf., Cincinnati, Ohio, June.
Zhoe, P. et al., 1999, “Thermomechanical Diagnostics of BGA Packages Using Digital Image/Speckle Correlation,” Proc. 7th Inter Society Conference on Thermal Phenomena, Vol. 2, pp. 240–245.
McKeown, S., 1999, Mechanical Analysis of Electronic Packaging Systems, First Edition, Marcel Dekker.
Pecht, M., 1999, Electronic Packaging Materials and Their Properties, CRC Press.
Stolkarts V. et al., 1998, “Constitutive and Damage Model for Solder,” IEEE 48th ECTC, pp. 379–385.
Cote, K., 2000, “Validation of Electronic Package Reliability Using Speckle Interferometry,” Master’s thesis, California State University of Long Beach.

Figures

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Temperature dependent CTE results for BT resin materials
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Typical phase map image from tensile testing, resulting y-displacement, and calculated Y-axis tensile strain
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Stress-strain curve of BT material at 25°C using both strain extensometer and ESPI to record strain values
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Schematic of LGA test assembly
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Fringe pattern from speckle pattern correlation between 125°C and 25°C
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Calculated strain in the package assembly due to thermal loading

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