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PAPERS ON RELIABILITY

Thermomechanical Durability of High I/O BGA Packages

[+] Author and Article Information
P. Davuluri, S. Shetty, A. Dasgupta

CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

S. Young

General Dynamics Information Systems, MN 55431

J. Electron. Packag 124(3), 266-270 (Jul 26, 2002) (5 pages) doi:10.1115/1.1477192 History: Received September 20, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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References

Figures

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Steps to evaluate solder life
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2D Slice: diagonal cross sections modeled with uniform out-of-plane depth
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Hybrid technique combining compact models with MDRR
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Pseudo-3D model: varying out-of-plane modeled along x-direction
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Compact model in conjunction with MDRR
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Plot of solder joint life versus critical joint lumping scheme
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Sensitivity to change in critical volume fraction
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Parametric variation of solder interconnect volume
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Comparison of failure predictions of higher models with experiment

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