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PAPERS ON RELIABILITY

Thermomechanical Durability of High I/O BGA Packages

[+] Author and Article Information
P. Davuluri, S. Shetty, A. Dasgupta

CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

S. Young

General Dynamics Information Systems, MN 55431

J. Electron. Packag 124(3), 266-270 (Jul 26, 2002) (5 pages) doi:10.1115/1.1477192 History: Received September 20, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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References

Lau, J. H., and Lee, R., 1997, “Solder Joint Reliability of Plastic Ball Grid Array with Solder Bumped Flip Chip,” American Society of Mechanical Engineers (Paper) Nov. 16–21, ASME 0402-1215.
Gustafsson, G., et al., 2000, “Finite Element Modeling of BGA Packages for Life Prediction,” Proceedings of Electronic Components and Technology Conference, May, pp. 1059–1063.
Darveaux, R., 1997, “Solder Joint Fatigue Life Model,” Proceedings TMS Annual Meeting, Feb., pp. 213–218.
Darveaux, R., 2000, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,” Proceedings of Electronic Components and Technology Conference, May, pp. 1048–1058.
Ling,  S., and Dasgupta,  A., 1996, “A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints,” ASME J. Electron. Packag., 118, pp. 72–79.
Ling,  S., and Dasgupta,  A., 1997, “A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints-Part 2,” ASME J. Electron. Packag., 119, pp. 177–182.
Lings, S., 1997, “A Multi-Domain Rayleigh Ritz Method for Thermomechanical Stress Analysis of Surface Mount Interconnects in Electronic Assemblies,” Ph.D. dissertation, University of Maryland College Park.
Rassain, M., and Lee, J., 1998, “Thermomechanical Multi-Domain Stress Modeling for Fatigue Analysis of Electronic Packaging,” IEEE Aerospace Conference, Los Alamitos, CA, Vol. 1, pp. 399–408.
Darbha,  K., and Dasgupta,  A., “A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation,” ASME J. Electron. Packag., 123, pp. 141–146.
Darbha,  K., and Dasgupta,  A., “A Nested Finite Element Methodology (NFEM) for Stress Analysis of Flip Chip on Board Assemblies—Part II: Viscoplastic Analysis,” ASME J. Electron. Packag., 123, pp. 147–155.
Darbha, K., and Dasgupta, A., 1999, “A Nested Finite Element Methodology (NFEM) for Stress Analysis of Flip Chip Solder Interconnects: Part I—Elastic Analysis,” Proceedings Interpack ’99, Vol. 1, pp. 13–19.
Darbha, K., 1999, “A Nested Finite Element Methodology for Virtual Qualification of Area-Array Microelectronic Interconnect Assemblies,” Ph.D. Dissertation, University of Maryland College Park.
Skipor,  A. F., Harren,  S. V., and Botsis,  J., 1996, “On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder,” ASME J. Eng. Mater. Technol., 118, p. 1.
Weinhold, M., 1998, “Alternatives to FR4,” IPC Expo 1998; workshop W-09 Session: High Performance, High Density Base Material,
Darbha,  K., Okura,  J. H., Shetty,  S., and Dasgupta,  A., 1999, “Thermomechanical Durability Analysis of Flip Chip Solder Interconnects-II. With Underfill,” ASME J. Electron. Packag., 121(4), pp. 237–241.
Dasgupta,  A., Oyan,  C., Barker,  D., and Pecht,  M., 1992, “Solder Creep-Fatigue Analysis by an Energy Partitioning Approach,” ASME J. Electron. Packag., 114, pp. 152–160.

Figures

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Steps to evaluate solder life
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2D Slice: diagonal cross sections modeled with uniform out-of-plane depth
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Hybrid technique combining compact models with MDRR
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Pseudo-3D model: varying out-of-plane modeled along x-direction
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Compact model in conjunction with MDRR
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Plot of solder joint life versus critical joint lumping scheme
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Sensitivity to change in critical volume fraction
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Parametric variation of solder interconnect volume
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Comparison of failure predictions of higher models with experiment

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