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PAPERS ON RELIABILITY

High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

[+] Author and Article Information
Elena Martynenko, Wen Zhou, Alexander Chudnovsky

Fracture Mechanics and Materials Durability Laboratory, Civil and Materials Engineering Department, The University of Illinois at Chicago, 842 W. Taylor Street (M/C 246), Chicago, IL 60607

Ron S. Li, Larry Poglitsch

Motorola Inc., Automotive Communications and Electronics Systems Group, 4000 Commercial Ave, Northbrook, IL 60062

J. Electron. Packag 124(3), 254-259 (Jul 26, 2002) (6 pages) doi:10.1115/1.1462628 History: Received December 07, 2000; Online July 26, 2002
Copyright © 2002 by ASME
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References

Viswanadham, P., and Singh, P., 1998, Failure Modes and Mechanisms in Electronic Packages, Chapman and Hall, New York.
Rao, S., ed., 1994, Proceedings of the Eighth Electronic Materials and Processing, ASM International.
Cluley, J. C., 1974, Electronic Equipment Reliability, Wiley, New York.
Hinch, S. W., 1988, Handbook of Surface Mount Technology, Longman Scientific & Technical, New York.
Sikonowiz, W., 1981, Designing and Creating Printed Circuits, Hayden Book Company, New Jersey.
Ginsberg, G. L., 1991, Printed Circuits Design, McGraw-Hill, New York.
C. F. Coombs Jr., 1988, Printed Circuits Handbook, 3rd edition, McGraw-Hill, New York.
Steinberg, D., 1988, Vibration Analysis for Electronic Equipment, Second Edition, Wiley, New York.
Gilleo, K., ed., 1992, Handbook of Flexible Circuits, Van Norstrand Reinhold.
Gurley, S., 1984, Flexible Circuits: Design and Applications, Marcel Dekker, New York and Basel.
Lu, M., Qian, Z., Liu, S., Li, R., and Poglitsch, L., 1999, “Thermo-Mechanical Behaviors of Flexible Substrates,” the Proceedings of SPIE on Microelectronics, Vol. 3582, 1998, pp. 214–218.
Li, R. S., and Jiao, J., 2000, “The Effects of Temperature and Aging on Young’s Moduli of Polymeric Based Flexible Substrates,” International Journal of Microcircuits and Electronic Packaging, 23 , No. 4, Fourth Quarter, pp. 456–461.

Figures

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Digital image of fracture surface of material system A under elevated temperature (100°C)
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Digital image of fracture surface of material system A under ambient temperature (23°C)
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S-N diagram for material system A constructed based on experimental and FEA data
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The FEA data: tensile stress versus displacement load
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The FEA data: tensile strain versus displacement load
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The Finite Element Analysis (FEA) model
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Displacement-time diagram of material system A
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S-N(D-N) diagram for material system A
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General schematic of load-transmitting support
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The internal experimental setup within the temperature chamber
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Sequence of sample installation
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Schematic of sample setup

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