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PAPERS ON RELIABILITY

High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

[+] Author and Article Information
Elena Martynenko, Wen Zhou, Alexander Chudnovsky

Fracture Mechanics and Materials Durability Laboratory, Civil and Materials Engineering Department, The University of Illinois at Chicago, 842 W. Taylor Street (M/C 246), Chicago, IL 60607

Ron S. Li, Larry Poglitsch

Motorola Inc., Automotive Communications and Electronics Systems Group, 4000 Commercial Ave, Northbrook, IL 60062

J. Electron. Packag 124(3), 254-259 (Jul 26, 2002) (6 pages) doi:10.1115/1.1462628 History: Received December 07, 2000; Online July 26, 2002
Copyright © 2002 by ASME
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References

Figures

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The FEA data: tensile stress versus displacement load
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S-N diagram for material system A constructed based on experimental and FEA data
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Digital image of fracture surface of material system A under ambient temperature (23°C)
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Digital image of fracture surface of material system A under elevated temperature (100°C)
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Schematic of sample setup
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Sequence of sample installation
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The internal experimental setup within the temperature chamber
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General schematic of load-transmitting support
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S-N(D-N) diagram for material system A
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Displacement-time diagram of material system A
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The Finite Element Analysis (FEA) model
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The FEA data: tensile strain versus displacement load

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