Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

[+] Author and Article Information
Y. W. Chan, T. H. Ju, Saeed A. Hareb, Y. C. Lee

Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309

Jih-Shun Wu

Semi-Custom Design and Manufacturing, Boulder, CO 80309

Mirng-Ji Lii

Intel Corporation, Chandler, AZ

J. Electron. Packag 124(3), 246-253 (Jul 26, 2002) (8 pages) doi:10.1115/1.1451844 History: Online July 26, 2002
Copyright © 2002 by ASME
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Configurations of cavity-up and -down PBGAs
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Quarter view of solder pads of the PBGAs studied
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Representation of combined warpage of package and PCB
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Macro/micro stress/strain modeling
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Shear forces-vs.-shear displacements for the equivalent beams and micro models
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Shear deformations of solder joints of the 72 I/O PBGA assembly at 125°C
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Effect of chip size on solder joint fatigue life
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Shapes of solder joints A and D under a bowl-type warpage
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Shapes of solder joints A and D under an arch-type warpage
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Macro model of the 540-I/O Assembly
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Effect of package substrate thickness on solder joint fatigue life




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