0
PAPERS ON RELIABILITY

Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

[+] Author and Article Information
Johan Liu, Zonghe Lai

Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, Argongatan 30, Se-431 53 Mölndal Göteborg, Sweden

J. Electron. Packag 124(3), 240-245 (Jul 26, 2002) (6 pages) doi:10.1115/1.1478059 History: Received July 27, 1999; Online July 26, 2002
Copyright © 2002 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Overview of the test chip with 100 μm in pitch
Grahic Jump Location
Cross-section of the test chip
Grahic Jump Location
Resistance measurement configuration for the single joint approach
Grahic Jump Location
Cross section of the ACA flip-chip assembled module on an FR-4 substrate
Grahic Jump Location
Overview of the FR-4 substrate for the flip-chip ACA assembly
Grahic Jump Location
Overview of the assembled flip-chip module using ACA adhesive A
Grahic Jump Location
Cross-section of the assembled flip-chip module using ACA adhesive A
Grahic Jump Location
Variation of contact resistance of the joints with different ACAs
Grahic Jump Location
Distribution of ACA joints with various contact resistance
Grahic Jump Location
Cumulative failure of Adhesive A flip-chip joints on an FR-4 substrate during the temperature cycling
Grahic Jump Location
Resistance of the ACA A joint change in temperature cycling test. Fundamental understanding of the gradual increase phenomenon of the single joint contact resistance of the ACA material shown in Fig. 11 is not available today. But it can be believed that ACA type of contacts partly follows the characteristics of the so-called Home contact and partly the characteristics of a metallurgical joint (atomic bonding followed by possible intermetallic formation).
Grahic Jump Location
Cumulative failure results of various ACA flip-chip joints. The results are based on manually measured data at room temperature at various cycles. The last curve is on a NCA conductive adhesive without filler. Reference of the number can be found in Table 1.
Grahic Jump Location
Weibull analysis of the ACA A flip-chip FR-4 joint when 20% resistance increase is used as the failure criteria.
Grahic Jump Location
Weibull analysis of ACA A flip-chip FR-4 joint when 50 mΩ is used as the failure criteria
Grahic Jump Location
Weibull analysis of ACA A flip-chip FR-4 joint when 100 mΩ is used as the failure criteria

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In