Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

[+] Author and Article Information
Y. T. Lin, C. T. Peng, K. N. Chiang

Dept. of Power Mechanical Engineering, National Tsing Hua University, HsinChu 30013, Taiwan

J. Electron. Packag 124(3), 234-239 (Jul 26, 2002) (6 pages) doi:10.1115/1.1481368 History: Received April 03, 2001; Online July 26, 2002
Copyright © 2002 by ASME
Your Session has timed out. Please sign back in to continue.


Elenius, P., 1998, “The UltraCSP Wafer Scale Package,” IEEE/CPMT Electronics Packaging Technology Conference, Proceedings of 2nd, pp. 83–88, Dec. 8–10, Singapore.
Wang, J., Qian, Z., Zou, D., and Liu, S., 1998, “Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moiré Interferometry,” Proceeding of Electronic Components and Technology Conference, 48th, Seattle, WA, USA, pp. 1438–1445, May 25–28.
Daveaux, R., and Benerji, K., 1991, “Fatigue Analysis of Flip Chip Assemblies Using Thermal Stress Simulations and a Coffin-Manson Relation,” 10569-5503/91/0000-0797 IEEE, pp. 797–805.
Goodman, T., and Elenius, P., 1997, “Flex-On-Cap Solder Paste Bumping,” Electronic Components and Technology Conference ’97, pp. 248–253.
Collins, J. A., 1984, “Failure of Materials in Mechanical Design—Analysis, Prediction, Prevention,” pp. 384–387.
Love et al. 1998, “Wire Interconnect Structure for Connecting an Integrated Circuit to a Substrate,” US patent No. 5,773,889, Jun. 30.
Coffin,  L. F., 1954, “A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal,” Trans. ASME, 76, pp. 931–950.
Cheng,  H. C., Chiang,  K. N., Chen,  C. K., and Lin,  J. C., 2001, “A Study of Factors Affecting Solder Joint Fatigue Life of Thermally Enhanced Ball Grid Array Assemblies,” Journal of the Chinese Institute of Engineers, 24, No. 4, pp. 439–451.
Manson,  S. S., 1965, “Fatigue: A Complex Subject-Some Simple Approximations,” Experimental Mechanics, 5, No. 7, pp. 193–226.
Chiang,  K. N., and Cheng,  H. C., 2000, “On Enhancing Eutectic Solder Joint Using A 2nd-Reflow-Process Approach,” IEEE Transaction on Advanced Packaging, 23(1), pp. 9–14, Feb..
Sauber,  J., and Seyyedi,  J., 1992, “Predicting Thermal Fatigue Lifetimes for SMT Solder Joints,” ASME Journal of Electronic Packaging, 114, pp. 472–476.
Yeh,  C. P., Zhou,  Wen X., and Wyatt,  K., 1996, “Parametric Finite Element Analysis of Flip Chip Reliability,” The International journal of Microcircuits and Electronic Packaging, 19(2), pp. 120–127, Second Quarter.
Qian, Z., and Liu, S., 1998, “On the Life Prediction and Accelerated Testing of Solder Joints,” EEP-Vol. 24, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, ASME, International Mechanical Engineering Congress and Exposition, Anaheim, CA, pp. 1–11, Nov. 15–20.
Cheng,  H. C., Chiang,  K. N., and Lee,  M. H., 1998, “An Alternative Local/Global Finite Element Approach for Ball Grid Array Typed Packages,” ASME Journal of Electronic Packaging, 120, pp. 129–134.
Subbarayan,  G., Ferri,  M. G., and DeFpster,  S. M., 1996, “Reliability of Metallized Ceramic Packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B, 19, No. 3, pp. 685–691.


Grahic Jump Location
Top and cross-section view of conventional flip-chip BGA package without underfill layer
Grahic Jump Location
Stress/strain curve of 60Sn/40Pb eutectic solder
Grahic Jump Location
One-half finite element model of flip-chip BGA package
Grahic Jump Location
Wire interconnect technology (source: Fujitsu)
Grahic Jump Location
Flip chip without underfill Laser Moiré phase diagram and refined fringe
Grahic Jump Location
Half FEM Model of WIT wafer level package with 4, 5 and 7 column posts
Grahic Jump Location
Half FEM model of conventional wafer level package with 4 solder bumps
Grahic Jump Location
Illustrations of FEM models of parametric study
Grahic Jump Location
Stress/strain curve of polyimide
Grahic Jump Location
Accumulated equivalent plastic strain versus cycling time of conventional WLP
Grahic Jump Location
Accumulated equivalent plastic strain versus cycling time of WIT Model 1
Grahic Jump Location
Max. strain of outmost column post of WIT Model 2




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In