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TECHNICAL PAPERS

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

[+] Author and Article Information
Sheng Liu, I. Charles Ume

School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Electron. Packag 124(3), 221-226 (Jul 26, 2002) (6 pages) doi:10.1115/1.1464878 History: Received September 14, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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References

Figures

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Finite element model of a good chip
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Finite element model of a chip with one solder ball missing
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Scanning pattern of flip-chip samples
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Solder joints of flip-chip samples
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Signal recorded for frequency analysis
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Power spectrum of Good Chip 1
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Power spectrum of Good Chip 2
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Power Spectrum of Bad Chip 1
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Signal at detection point A
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Signal at detection point B
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Signal at detection point C
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Signal at detection point D
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Error ratio of Good Chip 2
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Error ratio of Bad Chip 1

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