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TECHNICAL PAPERS

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

[+] Author and Article Information
Sheng Liu, I. Charles Ume

School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Electron. Packag 124(3), 221-226 (Jul 26, 2002) (6 pages) doi:10.1115/1.1464878 History: Received September 14, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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References

Sandra,  L. B. 1998, “Automatic Solder Joint Inspection,” IEEE Trans. Pattern Anal. Mach. Intell., 10(1), Jan.
Edward, S., 1991, “X-Ray Systems Keep Pace with SMT,” Test Meas. World, Feb.
Adams,  Tom, 1995, “Acoustic micro imaging of flip chip interconnects,” III-Vs Review, 8, No. 5, Oct., pp. 50–52.
Semmens, Janet E., and Kessler, Lawrence W., 1997, “Further investigation into the use of acoustic micro imaging for analyzing flip chip integrity and failure modes,” Proceedings of SPIE, pp. 165–169.
Kubota,  J., Musha,  Y., and Takahashi,  M., 1992, “Imaging flaws in soldered joints of integrated circuits using an ultrasound electronic scanning technique,” IEEE Trans. Ultrason. Ferroelectr. Freq. Control, 39(1), Jan., pp. 122–126.
Newman,  K. E. , 1998, “Parallel Test Method for MCM Substrate Interconnection Networks,” Int. J. Microcircuits Electron. Packag., 21(2).
Vanzetti, Ricardo, and Traub, Alan C., 1989, “Laser induced infrared signature: the stepping stone to statistical process control for PTH, SMT, FPT and TAB,” International SAMPE Symposium and Exhibition, CA, pp. 130–140.
Yojima, M., Juzumi, H., and Nishiyama, T., 1998, “Non-contact LSI-package solder-joint inspection method using an electro-optic probe,” Proceedings of SPIE—The International Society for Optical Engineering, Vol. 3582, pp. 132–137.
Lau,  John, and Keely,  A. Catherine, 1989, “Dynamic characterization of surface-mount component leads for solder joint inspection,” IEEE Transaction of Surface-Mount Component Leads for Solder Joint Inspection, 12, Dec., pp. 594–602.
Timoshenko, S., and Woinwsky-Krieger, S., 1959, Theory of Plates and Shells, McGraw-Hill, New York.
Gorman, Daniel J., 1982, Free Vibration Analysis of Rectangular Plates, Elsevier, North Holland.
Liu, Erdahl, Ume and Achari, 2000, “A Novel Method and Device for Solder Joint Quality Inspection by using Laser Ultrasound,” IEEE ECTC 2000 Conference, Las Vegas, May.
Scruby, C. B., and Drain, L. E., 1990, Laser Ultrasonics: Techniques and Applications, Adam Hilger, New York.
Sanderson,  T., Ume,  C., and Jarzynski,  J., 1998, “Experimental and Numerical Results for Intensity Modulated Laser Ultrasonic,” J. Acoust. Soc. Am., 104(4), Oct, pp. 2207–2212.

Figures

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Finite element model of a good chip
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Finite element model of a chip with one solder ball missing
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Scanning pattern of flip-chip samples
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Solder joints of flip-chip samples
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Signal recorded for frequency analysis
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Power spectrum of Good Chip 1
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Power spectrum of Good Chip 2
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Power Spectrum of Bad Chip 1
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Signal at detection point A
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Signal at detection point B
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Signal at detection point C
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Signal at detection point D
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Error ratio of Good Chip 2
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Error ratio of Bad Chip 1

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