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TECHNICAL PAPERS

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

[+] Author and Article Information
John H. Lau, S. W. Ricky Lee, Stephen H. Pan, Chris Chang

Agilent Technologies, Inc., 350 W. Trimble Road, MS 90LJ, San Jose, CA 95131

J. Electron. Packag 124(3), 205-211 (Jul 26, 2002) (7 pages) doi:10.1115/1.1462626 History: Received August 09, 2000; Online July 26, 2002
Copyright © 2002 by ASME
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References

Figures

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(a) SRAM chip with solder bumps, (b) dimensions of the chip
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(a) Top side of the μ VIP substrate, (b) bottom side of the μVIP substrate
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(a) Top side of the μVIP substrate, (b) bottom side of the μVIP substrate, (c) cross section of μVIP, (d) cross section of μVIP, (e) X-ray image of μVIP, (f) closed-up X-ray image of μVIP
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μVIP CSP cross sections. (a) Along the chip pads, (b) along the μVIP, (c) schematic of the μVIP solder joint, (d) cross section of the CSP with μVIP, (e) cross section of the CSP with μVIP, (f) X-ray image of the μVIP CSP assembly.
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(a) and (b) Cross sections of the μVIP CSP PCB assembly
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Details of the μVIP solder joint
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Temperature profile for modeling and testing
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Deformed shape of the μVIP CSP PCB assembly
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Maximum von Mises stress in the corner μVIP solder joint
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Maximum equivalent plastic strain in the corner μVIP solder joint
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Von Mises stress (MPa) in the copper plating of the corner μVIP
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Steady-state creep constitutive relations for the 63Sn-37Pb (Norton creep law) and 62Sn-2Ag-36Pb (Garofalo creep law) solders
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Time-dependent shear stress at the corner μVIP solder joint’s critical location
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Time-dependent shear creep strain at the corner μVIP solder joint’s critical location
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Hysteresis loops of the shear stress and shear creep strain at the μVIP solder joint’s critical location
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Time-dependent creep strain energy density at the μVIP solder joint’s critical location

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