Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

[+] Author and Article Information
Shiva P. Gadag

Mechanical Engineering Department, University of Colorado at Boulder, Boulder, CO 80309

Susan K. Patra, Phillipe Marchand

Optical Micro-Machines Inc., San Diego, CA 92122

Volkan Ozguz

Irvine Sensors Corporation, Costa Mesa, CA 92626

Sadik Esener

Electrical and Computer Engineering Department, University of California, San Diego, CA 92093-0407

J. Electron. Packag 124(3), 198-204 (Jul 26, 2002) (7 pages) doi:10.1115/1.1481894 History: Received September 05, 2000; Online July 26, 2002
Copyright © 2002 by ASME
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The composition of composite structural stack of functional Si-processor chip
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The I-Principal stress distribution and stress concentration in the structural stack unit at temperature of 49.7°C due to 0.5 W/layer
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Natural convection of entire thermal emulator cube in free-space with Diamond heat sink and a AlN ceramic cap, showing uniform heat at the core of the cube
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Natural convection of thermal emulator cube in Free-Space with AlN heat sink shows a hot spot confined to the core of the cube
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The quarter cube model of functional emulator cube consisting of (a) Si-active—diamond sink stack and (b) Si active—AlN sink composite stacked layers, to illustrate mode of heat propagation in cross section of the two types entire emulator cubes
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Effect of (a) substrate and (b) forced convection on the temperature of thermal cube
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Thermal resistance of emulator cube-on-AlN plate reduces by an order of magnitude for tenfold increase in convection
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Thermal model of the buffer cube-on-flex cable developed for the thermal simulation
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Silicon spacer (3000 μm) around the active core of buffer consisting of Si-processing stacks is designed for enhanced heat dissipation of buffer module. The Si-active stacks embedded in core of Si-spacer with a ceramic cap of Aluminum Nitride (AlN) on one side of the buffer.
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Thermal distribution in the buffer due to the heat of active Si-processor embedded in the core of emulator cube at a power density of 78.0 W/cm3



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