0
TECHNICAL PAPERS

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

[+] Author and Article Information
Shiva P. Gadag

Mechanical Engineering Department, University of Colorado at Boulder, Boulder, CO 80309

Susan K. Patra, Phillipe Marchand

Optical Micro-Machines Inc., San Diego, CA 92122

Volkan Ozguz

Irvine Sensors Corporation, Costa Mesa, CA 92626

Sadik Esener

Electrical and Computer Engineering Department, University of California, San Diego, CA 92093-0407

J. Electron. Packag 124(3), 198-204 (Jul 26, 2002) (7 pages) doi:10.1115/1.1481894 History: Received September 05, 2000; Online July 26, 2002
Copyright © 2002 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
The composition of composite structural stack of functional Si-processor chip
Grahic Jump Location
The I-Principal stress distribution and stress concentration in the structural stack unit at temperature of 49.7°C due to 0.5 W/layer
Grahic Jump Location
Natural convection of entire thermal emulator cube in free-space with Diamond heat sink and a AlN ceramic cap, showing uniform heat at the core of the cube
Grahic Jump Location
Natural convection of thermal emulator cube in Free-Space with AlN heat sink shows a hot spot confined to the core of the cube
Grahic Jump Location
The quarter cube model of functional emulator cube consisting of (a) Si-active—diamond sink stack and (b) Si active—AlN sink composite stacked layers, to illustrate mode of heat propagation in cross section of the two types entire emulator cubes
Grahic Jump Location
Effect of (a) substrate and (b) forced convection on the temperature of thermal cube
Grahic Jump Location
Thermal resistance of emulator cube-on-AlN plate reduces by an order of magnitude for tenfold increase in convection
Grahic Jump Location
Thermal model of the buffer cube-on-flex cable developed for the thermal simulation
Grahic Jump Location
Silicon spacer (3000 μm) around the active core of buffer consisting of Si-processing stacks is designed for enhanced heat dissipation of buffer module. The Si-active stacks embedded in core of Si-spacer with a ceramic cap of Aluminum Nitride (AlN) on one side of the buffer.
Grahic Jump Location
Thermal distribution in the buffer due to the heat of active Si-processor embedded in the core of emulator cube at a power density of 78.0 W/cm3

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In