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TECHNICAL PAPERS

Effective Local Flexural Stiffness of Ball Grid Array Assemblies

[+] Author and Article Information
Jung-Chuan Lee, Mostafa Rassaian

The Boeing Company, P.O. Box 3999, Seattle, WA 98124 e-mail: jungchuan.lee@boeing.com

J. Electron. Packag 124(3), 192-197 (Jul 26, 2002) (6 pages) doi:10.1115/1.1463733 History: Received June 15, 2000; Online July 26, 2002
Copyright © 2002 by ASME
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References

Suhir,  E., 1988, “On a Paradox Phenomenon Related to Beams on Elastic Foundation: Could External Compliant Leads Reduce the Strength of a Surface-Mounted Device?” ASME J. Appl. Mech., 55, pp. 818–821.
Barker,  D. B., and Sidharth,  D. B., 1994, “Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment,” ASME J. Electron. Packag., 116, pp. 92–97.
Engel,  P. A., 1990, “Structural Analysis For Circuit Card Systems Subjected to Bending,” ASME J. Electron. Packag., 112, pp. 2–10.
Engel,  P. A., Caletka,  D. V., and Palmer,  M. R., 1991, “Stiffness and Fatigue for Surface Mounted Module/Lead/Card Systems,” ASME J. Electron. Packag., 113, pp. 129–137.
Engel,  P. A., and Ling,  Y., 1993, “Torsion of Elastically Coupled Plates With Applications to Electronic Packaging,” ASME J. Electron. Packag., 115, pp. 22–27.
Engel, P. A. 1993, Structural Analysis Printed Circuit Board Systems, Spring-Verlag, New York.
Chang,  T. S., and Magrab,  E. B., 1991, “An Improved Procedure for the Determination of the Elastic Constants of Component-Lead-Board Assemblies,” ASME J. Electron. Packag., 113, pp. 427–430.
Barker,  D. B., Chen,  Y. S., and Dasgupta,  A., 1993, “Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components,” ASME J. Electron. Packag., 115, pp. 195–200.
Ling,  S., and Dasgupta,  A., 1996, “A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joint,” ASME J. Electron. Packag., 118, pp. 72–79.
Rassaian, M., and Lee, J. C., 1998, “Thermomechanical Multi-Domain Stress Modeling for Fatigue Analysis of Electronic Packaging,” IEEE Aerospace Conference, Aspen, CO, Mar.
Rassaian, M., Chang, M., and Lee, J. C., 1998, “Multi-Domain Analysis of PBGA Solder Connect for Structural Design Optimization,” 48th Electric Components and Technology Conference, Seattle, WA.

Figures

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Geometry for full-matrix BGA without underfill
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Geometry for perimeter BGA without underfill
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Illustration of multi-domain method (MDM)
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Method comparison for layered beam
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Finite element mesh for full-matrix BGA without underfill
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Multi-domain mesh for full-matrix BGA without underfill
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Finite element mesh for perimeter BGA without underfill
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Multi-domain mesh for perimeter BGA without underfill
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Maximum deflection of full-matrix BGA subjected to point load at lower-left corner of PWB
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Maximum deflection of perimeter BGA subjected to point load at lower-left corner of PWB
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Stress component σxx along centerline (x=0) for 225-ball full-matrix BGA
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Stress component σxx along centerline (x=0) for 176-ball perimeter BGA
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Effective flexural stiffness versus pitch for various types of geometry

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