0
TECHNICAL PAPERS

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

[+] Author and Article Information
Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung

Composite Materials Research Laboratory, University at Buffalo, The State University of New York, Buffalo, NY 14260-4400

J. Electron. Packag 124(3), 188-191 (Jul 26, 2002) (4 pages) doi:10.1115/1.1477191 History: Received May 03, 2001; Online July 26, 2002
Copyright © 2002 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Experimental setup for thermal contact conductance testing

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In