Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

[+] Author and Article Information
J. H. Okura

Nokia Mobile Phones, Connection Drive 6000, Irving, TX 75039

A. Dasgupta

CALCE Electronic Products and Systems Consortium, University of Maryland, College Park, MD 20742

J. F. J. M. Caers

Philips Centre for Manufacturing Technology, P. O. Box 218, 5600 MD Eindhoven, The Netherlands

J. Electron. Packag 124(3), 184-187 (Jul 26, 2002) (4 pages) doi:10.1115/1.1477193 History: Received August 22, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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FCOB configuration with underfill
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Intermetallic cracking mechanism in FCOB solder joint due to hygromechanical swelling of underfill (Oesterholt 6)
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(a) Schematic view of the 5×5 mm die showing the solder bumps, (b) cross section of the specimen showing the different modes of test
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Fixture to enable loading of the specimen in a tensile testing machine
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Thickness of the intermetallic compound at different aging times, and thickness of the copper layer
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Average strength of solder joints at different intermetallic thickness, for opening and shear modes
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Schematic illustration of the 5×5 mm FCOB configuration for FEM modeling
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Schematic illustration of the FEM mesh for FCOB configuration
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Contour plot of moisture concentration, predicted by finite element simulation
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Contour plot of peeling stress (σyy) in solder joint, predicted by finite element simulation
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Accelerated life test data of FCOB assemblies with two types of underfill including 95 percent confidence limits (Oesterholt 6)
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Strength of the intermetallic, stress in the solder joint, and accelerated life testing data plot for several test conditions as a function of time




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