0
TECHNICAL PAPERS

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

[+] Author and Article Information
A. Bhattacharya, R. L. Mahajan

CAMPmode, Mechanical Engineering Department, University of Colorado, Campus Box 427, Boulder, CO 80309–0427

J. Electron. Packag 124(3), 155-163 (Jul 26, 2002) (9 pages) doi:10.1115/1.1464877 History: Received September 05, 2000; Online July 26, 2002
Copyright © 2002 by ASME
Your Session has timed out. Please sign back in to continue.

References

Semiconductor Industry Association, 1998, The national technology roadmap for semiconductors, SIA, California.
Kraus, A. D., and Bar-Cohen, A., 1983, Thermal analysis and control of electronic equipment, Hemisphere, New York.
Incropera,  F. P., 1988, “Convection heat transfer in electronic equipment cooling,” ASME J. Heat Transfer, 110, pp. 1097–1111.
Peterson,  G. P., and Ortega,  A., 1990, “Thermal control of electronic equipment and devices,” Adv. Heat Transfer, 20, pp. 181–314.
Tuckerman,  D. B., and Pease,  R. F. W., 1981, “High Performance heat sinking for VLSI,” IEEE Electron Device Lett., EDL-2, No. 5, pp. 126–129.
Goldberg,  N., 1984, “Narrow channel forced air heat sink,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 7, No. 1, pp. 154–159.
Bejan,  A., and Sciubba,  E., 1992, “The optimal spacing of parallel plates cooled by forced convection,” Int. J. Heat Mass Transf., 35, pp. 3259–3264.
Knight,  R. W., Goodling,  J. S., and Hall,  D. J., 1991, “Optimal thermal design of forced convection heat sinks–analytical,” ASME J. Heat Transfer, 113, pp. 313–321.
Lau,  K. S., and Mahajan,  R. L., 1989, “Effects of tip clearance and fin density on the performance of heat sinks for VLSI packages,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 12, No. 4, 757–765.
Sparrow,  E. M., Baliga,  B. R., and Patankar,  S. V., 1978, “Forced convective heat transfer from a shrouded fin array with and without tip clearance,” ASME J. Heat Transfer, 100, pp. 572–579.
Kadle,  D. S., and Sparrow,  E. M., 1986, “Numerical and experimental study on turbulent heat transfer and fluid flow in longitudinal fin arrays,” ASME J. Heat Transfer, 108, pp. 16–23.
Jelenik, M., “Optimum array of cooling fins,” MS Thesis, Ben-Gurion University of Negev, Beer Sheva, Israel.
Sathe, S. B., Sammakia, B. G., Wong, A. C., and Mahaney, H. V., 1995 “A numerical study of a high-performance air-cooled heat sink,” National Heat Transfer Conference–Volume 1, HTD ASME, Vol. 303, pp. 43–53.
Hilbert,  C., Sommerfeldt,  S., Gupta,  O., and Herell,  D. J., 1990, “High performance air cooled heat sinks for integrated circuits,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 13, No. 4, pp. 1022–31.
Hwang,  L. T., Turlik,  I., and Reisman,  A., 1987, “A thermal module design for advanced packaging,” J. Electron. Mater., 16, No. 5, pp. 347–355.
Calmidi, V. V., 1998, “Transport Phenomena in High Porosity Metal Foams,” Ph.D. thesis, University of Colorado.
Calmidi, V. V., Calmidi M., and Mahajan, R. L., 2000, “Finned Metal Foam Heat Sink,” U.S. patent filed, University of Colorado.
Calmidi,  V. V., and Mahajan,  R. L., 2000, “Forced Convection in High Porosity Metal Foams,” ASME J. Heat Transfer, 122, pp. 557–565.
Hunt,  M. L., and Tien,  C. L., 1988, “Effects of Thermal Dispersion on Forced Convection in Fibrous Media,” Int. J. Heat Mass Transf., 31, pp. 301–309.
Lu,  T. J., Stone,  H. A., and Ashby,  M. F., 1998, “Heat transfer in open-cell metal foams,” Acta Mater., 46, pp. 3619–3635.
Lee, Y. C., Zhang, W., Xie, H., and Mahajan, R. L., 1993 “Cooling of a FCHIP package with 100 W, 1 cm2 chip,” Proceedings of the 1993 ASME Int. Elec. Packaging Conference, Vol. 1, pp. 419–423.
Bhattacharya,  A., Calmidi,  V. V., and Mahajan,  R. L., 2002, “Thermophysical Properties of High Porosity Metal Foams,” Int. J. Heat Mass Transf., 45, pp. 1017–1031.
Bejan, A., 1993, Heat Transfer, Wiley, New York.
Nield, D. A., and Bejan, A., 1999, Convection in porous media, 2nd ed., Springer-Verlag, New York.
Taylor, T. R., 1980, An Introduction to Error Analysis—The Study of Uncertainties in Physical Measurements, University Science Books, Mill Valley, California.
Calmidi,  V. V., and Mahajan,  R. L., 1999, “The effective thermal conductivity of high porosity metal foams,” ASME J. Heat Transfer, 121, pp. 466–471.
Hsu,  C. T., and Cheng,  P., 1990, “Thermal Dispersion in a porous medium,” Int. J. Heat Mass Transf., 33, pp. 1587–1597.
Cheng, P., Chowdhury, A., and Hsu, C. T., 1990, “Free Convection in packed tubes and channels with variable porosity and thermal dispersion effects,” Convective Heat and Mass Transfer in Porous Media, NATO ASI Series, Series E, Applied Sciences—Vol. 196, Kakac, S. et al., eds. pp. 625–653.
Verschoor,  H., and Schuit,  G. C. A., 1952, “Heat Transfer to fluids flowing through a bed of granular solids,” Appl. Sci., 42, pp. 97–119.
Nield,  D. A., 1998, “Effects of Local Thermal Nonequilibrium in Steady Convective Processes in a Saturated Porous Medium: Forced Convection in a Channel,” Journal of Porous Media, 1(2), pp. 181–186.

Figures

Grahic Jump Location
Picture of metal foam (5 PPI)
Grahic Jump Location
Schematic of the novel finned metal foam heat sink proposed by Calmidi et al. 17
Grahic Jump Location
Thermal resistance as a function of average velocity
Grahic Jump Location
Schematic of the fabricated 1—finned metal foam heat sink
Grahic Jump Location
Pictures of the metal foam heat sinks with one and four fins used in our study
Grahic Jump Location
Schematic of the experimental setup
Grahic Jump Location
Plot of heat transfer coefficient as a function of air velocity for the 20 PPI foam samples
Grahic Jump Location
Plot of pressure drop at different air velocities for the 20 PPI foam samples
Grahic Jump Location
Heat transfer coefficients for the 5 PPI samples as a function of flow velocity
Grahic Jump Location
Pressure drop characteristics of the 5 PPI samples as a function of flow velocity
Grahic Jump Location
Heat transfer coefficients for the samples with four fins
Grahic Jump Location
Pressure drop characteristics for the samples with four fins
Grahic Jump Location
Experimental Nusselt numbers versus empirical correlation [Eq. (10)] for finned metal foam heat sinks
Grahic Jump Location
Schematic of the longitudinal finned heat sink of Lau and Mahajan 9
Grahic Jump Location
Comparison of heat transfer coefficients for longitudinal finned and finned metal foam (20 PPI) heat sinks
Grahic Jump Location
System curves for the different heat sinks along with the fan curve
Grahic Jump Location
Heat transfer coefficient ratio for channel flows
Grahic Jump Location
Comparison of the experimental and theoretical [Eq. (15)] Nusselt numbers

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In