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TECHNICAL PAPERS

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

[+] Author and Article Information
Robert Darveaux

1900 South Price Road, Chandler, AZ 85248

J. Electron. Packag 124(3), 147-154 (Jul 26, 2002) (8 pages) doi:10.1115/1.1413764 History: Received June 26, 2000; Online July 26, 2002
Copyright © 2002 by ASME
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References

Darveaux, R., Banerji, K., Mawer, A., and Dody, G., 1995, “Reliability of Plastic Ball Grid Array Assembly,” Ball Grid Array Technology, J. Lau ed, McGraw-Hill, New York.
Darveaux, R., 1997, “Solder Joint Fatigue Life Model,” Proc. TMS.
Anderson, T., Guven, I., Madenci, E., and Gustafsson, G., 1999, “The Necessity of Reexamining Previous Life Prediction Analyses of Solder Joints in Electronic Packages,” Proc. ECTC.
Darveaux, R., 1995, “Optimizing the Reliability of Thin Small Outline Package (TSOP) Solder Joints,” Advances in Electronic Packaging 1995—Proc. ASME Interpack ’95, pp. 675–685.
Mawer, A., Trent, J., Vo, N., Vo, T., Guo, Y., Seto, P., Bosley, L., and Darveaux, R., 1997, “Reliability Evaluation of a PBGA MCM for Automotive Applications,” Proc. SMI, pp. 125–132.
Mawer, A., Cho, D., and Darveaux, R., 1996, “The Effect of PBGA Solder Pad Geometry on Solder Joint Reliability,” Proc. SMI, pp. 127–135.
Fusaro, J., and Darveaux, R., 1996, “Reliability of Copper Baseplate High Current Power Modules,” Proc. ISHM Symposium.
Amagai, M., 1998, “Chip Scale Package (CSP) Solder Joint Reliability and Modeling,” Proc. 36th International Reliability Physics Symposium, pp. 260–268.
Johnson, Z., 1999, “Implementation of and Extensions to Darveaux’s Approach to Finite-Element Simulation of BGA Solder Joint Reliability,” Proc. ECTC.
Darveaux, R., 2000, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,” Proc. ECTC.
Darveaux, R., 1993, “Crack Initiation and Growth in Surface Mount Solder Joints,” Proc. ISHM International Symposium on Microelectronics, pp. 86–97.
Clech, J-P., Noctor, D. M., Manock, J. C., Lynott, G. W., and Bader, F. E., 1994, “Surface Mount Assembly Failure Statistics and Failure Free Time,” Proc. 44th IEEE ECTC.
Mawer A., and Darveaux, R., 1993, “Calculation of Thermal Cycling and Application Fatigue Life of Plastic Ball Grid Array (PBGA) Package,” Proc. IEPS.
Darveaux, R., and Mawer, A., 1995, “Thermal and Power Cycling Limits of Plastic Ball Grid Array (PBGA) Assemblies,” Proc. Surface Mount International, pp. 315–326.
Petrucci, M., Johnson, R., Mawer, A., McQuiggin, T., Nelson, B., and Rosckes, D., 1993, “Feasibility Study of Ball Grid Array Packaging,” Proc. Nepcon East.
Ejim, T., Holliday, A., Bader, F. E., and Gahr, S., 1995, “Designed Experiment to Determine Attachment Reliability Drivers for PBGA Packages,” Proc. SMI, pp. 385–392.
Syed, A., Panczak, T., Darveaux, R., Lee, S. G., Lee, C. H., and Partridge, J., 1999, “Solder Joint Reliability of Chip Array BGA™,” Proc. SMTA, pp. 90–97.
Darveaux, R., and Mawer, A., 1998, “Solder Joint Fatigue Life of fleXBGA™ Assemblies,” Proc. ECTC, pp. 707–712.
Darveaux, R., Heckman, J., and Mawer, A., 1998, “Effect of Test Board Design on the 2nd Level Reliability of a Fine Pitch BGA Package,” Proc. SMI, pp. 105–111.
Darveaux, R., Heckman, J., Syed, A., and Mawer, A., 2000, “Solder Joint Fatigue Life of Fine Pitch BGAs-Impact of Design and Material Choices,” Microelectron. Reliab.
Anderson, T., Barut, A., Guven, I., and Madenci, E., 2000, “Revisit of Life Prediction Model for Solder Joints,” Proc. ECTC, pp. 1064–1069.
Madenci, E., 2000, private communication, June 6.
Gustafsson, G., Guven, I., Kradinov, V., and Madenci, E., 2000, “Finite Element Modeling of BGA Packages for Life Prediction,” Proc. ECTC, pp. 1059–1063.

Figures

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Solder joint fatigue life prediction method
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Crack growth rate correlation. Ansys 5.6, slice, nonlinear FEA, Anand constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack initiation correlation. Ansys 5.6, slice, nonlinear FEA, Anand constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack growth rate correlation. Ansys 5.6, quarter symmetry, nonlinear FEA, Anand constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack growth rate correlation. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Anand constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack growth rate correlation. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack growth rate correlations. Ansys 5.6, quarter symmetry, nonlinear FEA, Anand constitutive model. Comparison of element layer averaging schemes.
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Crack growth rate correlations. Comparison of modeling methodologies. Highlighted region indicates range of measured data.
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Model correlation for laminate based packages—characteristic life. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model, averaging over element layers 1+2, .001 in. total thickness.
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Model correlation for laminate based packages—first failure. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model, averaging over element layers 1+2, .001 in. total thickness.
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Model correlation for tape based packages—characteristic life. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model, averaging over element layers 1+2, .001 in. total thickness.
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Model correlation—relative prediction, characteristic life. Correction factor for each package type. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model, averaging over element layers 1+2, .001 in. total thickness.
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Model correlation for PBGA packages—characteristic life (from Ref 2). Ansys 5.2, orthogonal slice, nonlinear FEA, Anand constitutive model, averaging over 1 element layer, .0015 in. thickness, no derating factor for multiple joints.
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Model correlation for PBGA, CBGA, and TSOP packages—characteristic life (from 14). PBGA—orthogonal slice, CBGA—diagonal slice, TSOP— quarter symmetry with sub-structuring. Ansys 5.0, nonlinear FEA, partial Anand constitutive model (4 constants), primary+secondary cracks, no element averaging, derating factor for multiple joints, 1.53X correction factor.

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