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TECHNICAL PAPERS

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

[+] Author and Article Information
Robert Darveaux

1900 South Price Road, Chandler, AZ 85248

J. Electron. Packag 124(3), 147-154 (Jul 26, 2002) (8 pages) doi:10.1115/1.1413764 History: Received June 26, 2000; Online July 26, 2002
Copyright © 2002 by ASME
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References

Figures

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Solder joint fatigue life prediction method
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Crack growth rate correlation. Ansys 5.6, slice, nonlinear FEA, Anand constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack initiation correlation. Ansys 5.6, slice, nonlinear FEA, Anand constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack growth rate correlation. Ansys 5.6, quarter symmetry, nonlinear FEA, Anand constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack growth rate correlation. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Anand constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack growth rate correlation. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model. Averaging over element layers 1+2, .001 in. total thickness.
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Crack growth rate correlations. Ansys 5.6, quarter symmetry, nonlinear FEA, Anand constitutive model. Comparison of element layer averaging schemes.
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Crack growth rate correlations. Comparison of modeling methodologies. Highlighted region indicates range of measured data.
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Model correlation for laminate based packages—characteristic life. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model, averaging over element layers 1+2, .001 in. total thickness.
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Model correlation for laminate based packages—first failure. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model, averaging over element layers 1+2, .001 in. total thickness.
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Model correlation for tape based packages—characteristic life. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model, averaging over element layers 1+2, .001 in. total thickness.
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Model correlation—relative prediction, characteristic life. Correction factor for each package type. Ansys 5.6, quarter symmetry, linear FEA+1D nonlinear, Darveaux constitutive model, averaging over element layers 1+2, .001 in. total thickness.
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Model correlation for PBGA packages—characteristic life (from Ref 2). Ansys 5.2, orthogonal slice, nonlinear FEA, Anand constitutive model, averaging over 1 element layer, .0015 in. thickness, no derating factor for multiple joints.
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Model correlation for PBGA, CBGA, and TSOP packages—characteristic life (from 14). PBGA—orthogonal slice, CBGA—diagonal slice, TSOP— quarter symmetry with sub-structuring. Ansys 5.0, nonlinear FEA, partial Anand constitutive model (4 constants), primary+secondary cracks, no element averaging, derating factor for multiple joints, 1.53X correction factor.

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