0
TECHNICAL PAPERS

Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

[+] Author and Article Information
C. Q. Ru

Department of Mechanical Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G8e-mail: c.ru@ualberta.ca

J. Electron. Packag 124(3), 141-146 (Jul 26, 2002) (6 pages) doi:10.1115/1.1481037 History: Received October 14, 2001; Online July 26, 2002
Copyright © 2002 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Thermal stresses in a bimaterial strip due to a uniform change in temperature
Grahic Jump Location
The interfacial shear stress (MPa) (example 1)
Grahic Jump Location
The interfacial peeling stress (MPa) (example 1)
Grahic Jump Location
The interfacial shear stress (MPa) (example 2)
Grahic Jump Location
The interfacial peeling stress (MPa) (example 2)

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In