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TECHNICAL BRIEF

Impact of Low Temperatures on Solder Joint Failures

[+] Author and Article Information
Boris Mirman

Suffolk University, Boston, MA 02420-2211

J. Electron. Packag 124(2), 135-137 (May 02, 2002) (3 pages) doi:10.1115/1.1465431 History: Received December 29, 2000; Revised May 31, 2001; Online May 02, 2002
Copyright © 2002 by ASME
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References

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Mohr,  O., 1900, “Welche Umstände bedingen die Elastizitätsgrenze und den Bruch eines Materials?,” Zeitschrift des Vereines deutcher Ingenieure, 44, pp. 1524–1530.
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Zubelewicz, A., 1992, Private communication.

Figures

Grahic Jump Location
Four-circuit panel with 16 TSOP-I and 16 TSOP-II
Grahic Jump Location
Daisy-chains of the tested circuit
Grahic Jump Location
Force directions for cooling and heating for “chip on lead” configuration
Grahic Jump Location
Sketch for internal structure of TSOP. (a) “Chip on lead”; (b) “lead on chip”

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