Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

[+] Author and Article Information
Qizhou Yao, Jianmin Qu

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 124(2), 127-134 (May 02, 2002) (8 pages) doi:10.1115/1.1459470 History: Received April 16, 2001; Online May 02, 2002
Copyright © 2002 by ASME
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Various failure modes in a flip-chip package
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An idealized interface profile
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Interfacial and cohesive failure
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Equivalent interfacial cracks
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Equivalent cohesive cracks
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Surface profiles for various surfaces
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Autocorrelation functions of various surfaces
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Roughness of the Al surface before and after the application of adhesives
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SEM micrograph of Al surfaces before and after the application of adhesives
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XPS spectrum of the Al surfaces after application of adhesives
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Relative level of various elements on the Al surface application of adhesives
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Comparison between experimental and theoretical results




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