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TECHNICAL PAPERS

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

[+] Author and Article Information
E. H. Wong, R. Rajoo, S. W. Koh, T. B. Lim

Institute of Microelectronics, 11 Science Park Road, Science Park II, Singapore 117685

J. Electron. Packag 124(2), 122-126 (May 02, 2002) (5 pages) doi:10.1115/1.1461367 History: Received October 05, 2000; Online May 02, 2002
Copyright © 2002 by ASME
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References

Tanaka, N., Kitano, M., Kumazawa, T., and Nishimura, A., 1997, “Evaluation of Interface Delamination in IC Packages by Considering Swelling of the Molding Compound Due to Moisture Absorption,” 47th ECTC, pp. 84–90.
Wong, E. H., Chan, K. C., Tee, T. Y., and Rajoo, R., 1999, “Comprehensive Treatment of Moisture Induced Failure in IC Packaging,” 3rd IEMT, pp. 176–181.
Nguyen, L. T., Chen, K. L., and Schaefer, J., 1995, “A New Criterion for Package Integrity Under Solder Reflow Conditions,” 45th ECTC, pp. 478–490.
Liu, S., and Mei, Y., 1995, “Behavior of Delaminated Plastic IC Packages Subjected to Encapsulation Cooling, Moisture Absorption, and Wave Soldering,” IEEE CPMT Part A., Vol. 18, No. 3, pp. 634–645.
Lin, T. Y., and Tay, A. O., 1997, “Dynamics of Moisture Diffusion, Hygrothermal Stresses and Delamination in Plastic IC Packages,” ASME Advances in Electronic Packaging, EEP-Vol. 19-1, pp. 1429–1436.
Crank, J., and Park, G. S., 1956, The Mathematics of Diffusion, Oxford University Press.
Wong, E. H., Teo, Y. C., and Lim, T. B., 1998, “Moisture Diffusion and Vapor Pressure Modeling of IC Packaging,” 48th ECTC, pp. 1372–1378.
Teo, P. S., Huang, Y. W., Tung, C. H., Marks, M. R., and Lim, T. B., 2000, “Investigation of Under Bump Metallization Systems for Flip–Chip Assemblies,” 50th ECTC, pp. 33–39.
Tee, T. Y., Fan, X. J., and Lim, T. B., 1999, “Modeling of Whole Field Vapor Pressure During Reflow for Flip Chip BGA and Wire Bond PGA packages,” Int. W/S on Electronic Materials & Packaging.
Hertzberg, R. W., 1996, Deformation and Fracture Mechanics of Engineering Materials, Wiley, New York.
Huang, Y. W., Teo, K. W., Chua, K. L., Yang, M. W. R., and Ferng, W., 1999, “The Effects of Underfill on the Pressure Cooker Test Performance of Flip Chip on Board Assembly,” Proc. InterPack, pp. 1121–1127.
Caers, J. F. M., Oesterholt, R., Bressers, R. J. L., Mouthaan, T. J., and Verweij, J. F., 1999, “Reliability of Flip Chip on Board—First Order Model for the Effect on Contact Integrity of Moisture Penetration in the Underfill,” 48th ECTC, pp. 867–871.

Figures

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Critical sites of three types of packages
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Hygrothermal stresses and displacement contours of wire bonded PBGA package during moisture sensitivity test
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Hygroscopic swelling induced tensile failure in autoclave testing of flip chip PBGA package
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Hygroscopic swelling raises package stress during solder reflow
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Setup and technique for characterization of hygroscopic swelling property of material
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Linear relation between swelling and moisture content—demonstrated with a typical mold compound
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CME of packaging materials as a function of temperature
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Moisture distribution in PBGA package (quarter model) after 168 hr at 85°C/85%RH

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