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TECHNICAL PAPERS

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

[+] Author and Article Information
E. H. Wong, R. Rajoo, S. W. Koh, T. B. Lim

Institute of Microelectronics, 11 Science Park Road, Science Park II, Singapore 117685

J. Electron. Packag 124(2), 122-126 (May 02, 2002) (5 pages) doi:10.1115/1.1461367 History: Received October 05, 2000; Online May 02, 2002
Copyright © 2002 by ASME
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References

Figures

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Hygroscopic swelling raises package stress during solder reflow
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Setup and technique for characterization of hygroscopic swelling property of material
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Linear relation between swelling and moisture content—demonstrated with a typical mold compound
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CME of packaging materials as a function of temperature
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Moisture distribution in PBGA package (quarter model) after 168 hr at 85°C/85%RH
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Critical sites of three types of packages
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Hygrothermal stresses and displacement contours of wire bonded PBGA package during moisture sensitivity test
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Hygroscopic swelling induced tensile failure in autoclave testing of flip chip PBGA package

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