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TECHNICAL PAPERS

In-Plane Packaging Stress Measurements Through Piezoresistive Sensors

[+] Author and Article Information
Ben-Je Lwo

Department of Mechanical Engineering, Chung-Cheng Institute of Technology, National Defense University, Ta-Shi, Tao-Yuan, 335, Taiwan, R.O.C

Tung-Sheng Chen, Yu-Lin Lin

Electrical Engineering, Chung-Cheng Institute of Technology, National Defense University, Ta-Shi, Tao-Yuan, 335, Taiwan, R.O.C

Ching-Hsing Kao

Applied Physics, Chung-Cheng Institute of Technology, National Defense University, Ta-Shi, Tao-Yuan, 335, Taiwan, R.O.C

J. Electron. Packag 124(2), 115-121 (May 02, 2002) (7 pages) doi:10.1115/1.1452244 History: Online May 02, 2002
Copyright © 2002 by ASME
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References

Figures

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The configuration of a four-resistor rosette
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Rotation of coordinate systems
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Idealized representation (a) and actual schematic of the 4PB structure (b)
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Relative resistance changes for n-type resistors (a) and p-type resistors (b) for calibration
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σ11 versus temperature for batch #1(a), batch #2(b), and batch #3(c) of test sample
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σ22 versus temperature for batch #1(a), batch #2(b), and batch #3(c) of test sample
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σ12 versus temperature for batch #1 of test sample
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σ11 versus power for batch #1(a) and batch #3(b) of test sample
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σ22 versus power for batch #1(a) and batch #3(b) of test sample
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σ12 versus power for batch #1 of test sample

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