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TECHNICAL PAPERS

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

[+] Author and Article Information
Timothy Ferguson, Jianmin Qu

Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 124(2), 106-110 (May 02, 2002) (5 pages) doi:10.1115/1.1414133 History: Received July 12, 2000; Revised April 24, 2001; Online May 02, 2002
Copyright © 2002 by ASME
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References

Figures

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Bimaterial test specimen
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Representative load displacement test curve
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Loading diagram for a bimaterial with an interface crack
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Percent weight gain of UR-A interfacial fracture test specimens at 85°C/85%RH
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Percent weight gain of UR-B interfacial fracture test specimens at 85°C/85%RH
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Interfacial adhesion values for both fully dried and moisture preconditioned test specimens

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