Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

[+] Author and Article Information
L. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat

Delft University of Technology, P.O. Box 5033, 2600 GA Delft, The Netherlands

G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen

Philips, P.O. Box 218, 5600 MD Eindhoven, The Netherlands

J. Electron. Packag 124(2), 97-105 (May 02, 2002) (9 pages) doi:10.1115/1.1459471 History: Received July 06, 2000; Online May 02, 2002
Copyright © 2002 by ASME
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Flip chip demonstrator configuration
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FEM mesh used for curing stress/strain simulation
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Close up at the outer solder bump
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Stress and strain evolution in epoxy (point A)
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Von Mises stress distribution (60 min)
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Stress (relaxation) response on a unit step deformation/initial deformation at “load application time” ξ
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Coin-shaped resin sample+reference system
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Cure dependent axial deformation
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Definition of various time-variables
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Chosen relaxation times in minutes.
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Chosen DMA angular frequences (ωk) in rad/s
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Storage shear moduli G(ξ,,ωk)
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Cure dependent stiffness coefficients Gn{α(ξ)} for n=1,2,[[ellipsis]]..,7. {while G8{α(ξ)}∼0}
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Chosen DMA frequences (fk) in s−1
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Test facility for axial DMA and unit step relaxation measurements
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Longitudinal storage bulk modulus M(ξ,,ωk)
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Cure dependent stiffness coefficients Kn{α(ξ)} for n=1,2,3,4. (while K5∼K6∼K7∼0 and K8=1 GPa)




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