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TECHNICAL PAPERS

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

[+] Author and Article Information
Sung Yi, Guangxing Luo, Kerm Sin Chian

School of Mechanical and Production Engineering, Nanyang Technological University, Singapore, 639798, Republic of Singapore

J. Electron. Packag 124(2), 91-96 (May 02, 2002) (6 pages) doi:10.1115/1.1451845 History: Received May 29, 2001; Online May 02, 2002
Copyright © 2002 by ASME
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References

Grivas,  D., Murty,  K. L., and Morris,  J. W., 1979, “Deformation of Pb-Sn Eutectic Alloys at Relatively High Strain Rates,” Acta Metall., 27, pp. 731–737.
Mei,  Z., Morris,  J. W., Shine,  M. C., and Summers,  T. S. E., 1991, “Effects of Cooling Rate on Mechanical Properties of Near-eutectic Tin-Lead Solder Joints,” J. Electron. Mater., 20, No. 8, pp. 599–608.
Frear,  D., Grivas,  D., and Morris,  J. W., 1997, “A Microstructural Study of The Thermal Fatigue Failures of 60Sn40Pb Solder Joints,” J. Electron. Mater., 17, No. 2, pp. 280–285.
Hacke,  P. L., Sprecher,  A. F., and Conrad,  H., 1997, “Microstructure Coarsening during Thermomechanical Fatigue of Pb-Sn Solder Joints,” J. Electron. Mater., 26, No. 7, pp. 774–782.
Hacke,  P. L., Fahmy,  Y., and Conrad,  H., 1998, “Phase Coarsening and Crack Growth Rate during Thermo-Mechanical Cycling of 63Sn37Pb Solder Joints,” J. Electron. Mater., 27, No. 8, pp. 941–947.
Sayama, T., Takayanagi, T., and Mori, T., 1999, “Analysis of Phase Growth Process in Sn/Pb Eutectic Solder Joint,” Advances in Electronic Packaging, EEP-Vol. 26-1, ASME, pp. 581–587.
Geogre,  D. O., Michael,  S. P., Joleen,  R. P., Greg,  A. L., and Robert,  V. M., 1987, “Pb-Sn Alloy Microstructure: Potential Reliability Indicator for Interconnects,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 10, No. 1, pp. 82–88.
Darveaux,  R., and Banerji,  K., 1992, “Constitutive Relations for Tin-based Solder Joints,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 15, No. 6, pp. 1013–1024.
Knecht,  S., and Fox,  L. R., 1990, “Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 13, No. 2, pp. 424–433.
Busso,  E. P., Kitano,  M., and Kumazawa,  T., 1992, “A viscoplastic Constitutive Model for 60/40 Tin-Lead Solder used in IC Package Joints,” ASME J. Eng. Mater. Technol., 114, pp. 331–337.
Fu,  C., McDowell,  D. L., and Ume,  I. C., 1998, “A Finite Element Procedure of Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects,” ASME J. Electron. Packag., 120, pp. 24–34.
Ishikawa,  H., Sasaki,  K., and Ohguchi,  K., 1996, “Prediction of Fatigue Failure of 60Sn-40Pb Solder using Constitutive Model for Cyclic Viscoplasticity,” ASME J. Electron. Packag., 118, pp. 164–169.
Skipor,  A. F., Harren,  S. V., and Botsis,  J., 1996, “On the Constitutive response of 63/37Sn/Pb Eutectic Solder,” ASME J. Eng. Mater. Technol., 118, pp. 1–11.
Desai,  C. S., 1997, “Thermomechanical Response of Materials and Interfaces in Electronic Packaging. Part II-Unified Constitutive Models, Vialation, and Design,” ASME J. Electron. Packag., 119, pp. 301–309.
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Figures

Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of sample A at 100°C
Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of Sample A at 60°C
Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of sample A at 25°C
Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of sample A at −10°C
Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of sample B at 100°C
Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of sample B at 60°C
Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of sample B at 25°C
Grahic Jump Location
GM model prediction applied stress σ, internal stress xgb, internal stress xmc versus constant strain rate tensile tests of sample B at 60°C, strain rate=0.1
Grahic Jump Location
GM model prediction of constant strain rate tensile tests at 60°C, strain rate=0.1, with different phase size exponents
Grahic Jump Location
GM model prediction of constant strain rate tensile tests at 60°C, strain rate=0.1, with different matrix deformation exponents

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