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TECHNICAL PAPERS

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

[+] Author and Article Information
Sung Yi, Guangxing Luo, Kerm Sin Chian

School of Mechanical and Production Engineering, Nanyang Technological University, Singapore, 639798, Republic of Singapore

J. Electron. Packag 124(2), 91-96 (May 02, 2002) (6 pages) doi:10.1115/1.1451845 History: Received May 29, 2001; Online May 02, 2002
Copyright © 2002 by ASME
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References

Figures

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GM model prediction versus constant strain rate tensile tests of sample A at 100°C
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GM model prediction versus constant strain rate tensile tests of Sample A at 60°C
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GM model prediction versus constant strain rate tensile tests of sample A at 25°C
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GM model prediction versus constant strain rate tensile tests of sample A at −10°C
Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of sample B at 100°C
Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of sample B at 60°C
Grahic Jump Location
GM model prediction versus constant strain rate tensile tests of sample B at 25°C
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GM model prediction applied stress σ, internal stress xgb, internal stress xmc versus constant strain rate tensile tests of sample B at 60°C, strain rate=0.1
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GM model prediction of constant strain rate tensile tests at 60°C, strain rate=0.1, with different phase size exponents
Grahic Jump Location
GM model prediction of constant strain rate tensile tests at 60°C, strain rate=0.1, with different matrix deformation exponents

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