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TECHNICAL PAPERS

A New Creep Constitutive Model for Eutectic Solder Alloy

[+] Author and Article Information
X. Q. Shi, Z. P. Wang, Q. J. Yang

Gintic Institute of Manufacturing Technology, Nanyang Drive, Singapore 638075

W. Zhou, H. L. J. Pang

School of Mechanical & Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798

J. Electron. Packag 124(2), 85-90 (May 02, 2002) (6 pages) doi:10.1115/1.1462624 History: Received September 27, 2000; Online May 02, 2002
Copyright © 2002 by ASME
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References

Figures

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Stress exponent n as a function of temperature
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Steady-state creep shear strain rate versus reciprocal of absolute temperature
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Activation energy as a function of temperature at a given normalized shear stress level of τ/G=3.5×10−4
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Activation energy as a function of applied normalized shear stress for different temperatures
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63Sn/37Pb normalized steady-state creep behavior
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Comparison on creep shear strain rate obtained from the experimental tests and new creep model
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Cross-sectional view of the plastic BG assembly
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One eighth FE model for a 256 I/O PBGA
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Stress-strain hysteresis loop obtained from ATC simulation
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Creep-time curve obtained at 30 MPa, 25°C
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Steady-state creep behavior at different temperatures

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