0
TECHNICAL PAPERS

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

[+] Author and Article Information
John H. Lau, Stephen H. Pan, Chris Chang

Agilent Technologies, Inc., 5301 Stevens Creek Blvd., Santa Clara, CA 95052

J. Electron. Packag 124(2), 69-76 (May 02, 2002) (8 pages) doi:10.1115/1.1400995 History: Received August 08, 2000; Online May 02, 2002
Copyright © 2002 by ASME
Your Session has timed out. Please sign back in to continue.

References

Lau, J. H., 2000, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, McGraw-Hill, New York, NY.
Lau, J. H., and Lee, W-S. R., 1999, Chip Scale Package: Design, Materials, Process, Reliability, and Applications, McGraw-Hill, New York, NY.
Lau, J. H., and Pao, Y-H., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY.
Lau, J. H., 1996, Flip Chip Technologies, McGraw-Hill, New York, NY.
Lau, J. H., 1995, Ball Grid Technology, McGraw-Hill, New York, NY.
Darveaus, R., and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 538–551.
Lau,  J. H., 1993, “Creep of 96.5Sn-3.5Ag Solder Interconnects,” Soldering & Surface Mount Technology, 15, Sept., pp. 45–49.
Stromswold, E. I., 1993, “Characterization of Eutectic Tin-Silver Solder Joints,” Ph.D. dissertation, The University of Rochester.
Vianco,  P. T., and Vianco,  D. R., 1993, “Issues in the Replacement of Lead-Bearing Solders,” Journal of Metals , 45, No. 7, July, pp. 36–40.
McCormack,  M., and Jin,  S., 1993, “Progress in the Design of New Lead-Free Solders Alloys,” Journal of Metals, , 45, No. 7, July, pp. 14–19.
Felton,  L. E., Taeder,  C. H., and Knorr,  D. B., 1993, “The Properties of Tin-Bismuth Alloys,” Journal of Metals , 45, No. 7, July, pp. 20–25.
Glazer,  J., 1994, “Microstructure and Mechanical Properties of Pb-Free Solder Alloy for Low-Cost Electronic Assembly: A Review,” J. Electron. Mater., 23, No. 8, pp. 693–700.
Vianco, P. T., Erickson, K. L., and Hopkins, P. L., 1994, Solid State Intermetallic Compound Growth Between Copper and High Temperature, Tin-Rich Solder—Part 1: Experimental Analysis, Sandia National Labs (Contract Number DE-AC04-94AL85000) Report.
Kang,  S. K., and Sarkhel,  A. K., 1994, “Lead (Pb)—Free Solders for Electronic Packaging,” J. Electron. Mater., 23, No. 8, Aug., pp. 701–708.
Shangguan,  D., Achari,  A., and Green,  W., 1994, “Application of Lead-Free Eutectic Sn-Ag Solder in No-Clean Thick Film Electronic Modules,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 17, No. 4, pp. 603–611.
Yang,  W., Felton,  L. E., and Messler,  R. W., 1995, “The Effect of Soldering Process Variables on the Microstructure and Mechanical Properties of Eutectic Sn-Ag/Cu Solder Joints,” J. Electron. Mater., 24, No. 10, pp. 1465–1472.
Hwang, J. S., 1996, Modern Solder Technology for Competitive Electronics Manufacturing, McGraw-Hill, New York, NY.
Vianco, P., Rejent, J., Artaki, I., Ray, U., Finley, D., and Jackson, A., 1996, “Compatibility of Lead-Free Solders with Lead Containing Surface Finishes as a Reliability Issue in Electronic Assemblies,” Proceedings of the IEEE Electronic Components & Technology Conference, May, pp. 1172–1183.
Mei,  Z., and Holder,  H., 1996, “A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints,” ASME J. Electron. Packag., 118, June, pp. 62–66.
Ren,  W., Lu,  M., Liu,  S., and Shangguan,  D., 1997, “Thermal Mechanical Property Testing of New Lead-Free Solder Joints,” Soldering & Surface Mount Technology, 9, No. 3, Oct., pp. 37–40.
Shangguan,  D. A., and Gao,  G., 1997, “Lead-Free and No-Clean Soldering for Automotive Electronics,” Soldering & Surface Mount Technology, 9, No. 2, July, pp. 5–8.
NCMS, 1997, Lead-Free Solder Project Final Report, NCMS Report 040IRE96, Aug.
Mei, Z., Hua, F., Glazer, J., and Key, C., 1997, “Low Temperature Soldering,” Proceedings of IEMTS, Oct., pp. 463–476.
Iida, A., Kizaki, Y., Fukuda, Y., and Mori, M., 1997, “The Development of Repairable Au-Al Solid Phase Diffusion Flip-Chip Bonding,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 101–107.
Hua, F., Mei, Z., and Glazer, J., 1998, “Eutectic Sn-Bi as an Alternative to Pb-Free Solder,” Proceedings of Electronic Components & Technology Conference, May, pp. 277–283.
Grusd, A., 1998, “Lead Free Solders in Electronics,” Proceedings of Surface Mount International Conference, Aug. pp. 648–661.
Biocca, P., 1998, “Global Update on Lead-Free Solders,” Proceedings of Surface Mount International Conference, Aug., pp. 705–709.
Wege, S., Habenicht, G., and Bergmann, R., 1998, “Manufacture and Reliability of Alternate Solder Alloys,” Proceedings of Surface Mount International Conference, Aug., pp. 699–704.
Trumble, B., 1998, “Get the Lead Out,” IEEE Spectrum, May, pp. 55–60.
Smith III, E., and Swanger, L., 1999, “Lead Free Solders—A Push in the Wrong Directions?,” Proceedings of the IPC Technical Conference, Mar., pp. F-10-1–F-10-6.
Kang, S., Horkans, J., Andricacos, P., Carruthers, R., Cotte, J., Datta, M., Gruber, P., Harper, J., Kwietniak, K., Sambucetti, C., Shi, L., Brouillette, G., and Danovitch, D., 1999, “Pb-Free Solder Alloys for Flip Chip Applications,” Proceedings of IEEE Electronic Components & Technology Conference, June, pp. 283–288.
Lau,  J. H., and Chang,  C., 1999, “TMA, DMA, DSC, and TGA of Lead Free Solders,” Soldering & Surface Mount Technology, 11, No. 2, pp. 17–24.
Seelig, K., and Suraski, D., 2000, “The Status of Lead-Free Solder Alloys,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1405–1409.
Whitten, G., 2000, “Lead-free Solder Implementation for Automotive Electronics,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1410–1415.
Snowdon, K., Tanner, C., and Thompson, J., 2000, “Lead Free Soldering Electronic Interconnect: Current Status and Future Developments,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1416–1419.
Butterfield, A., Visintainer, V., and Goudarzi, V., 2000, “Lead Free Paste Flux Evaluation and Implementation in Personal Communication Devices,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1420–1425.
Nguty, T., Budiman, S., Rajkumar, D., Solomon, R., Ekere, N., and Currie, M., 2000, “Understanding the Process Window for Printing Lead-Free Solder Pastes,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1426–1435.
Ezawa, Hirokazu, Miyata, M., Honma, S., Inoue, H., Tokuoka, T., Yoshioka, J., and Tsujimura, M., 2000, “Eutectic Sn-Ag Solder Bump Process for ULSI Flip Chip Technology,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1095–1100.
Baynham, G., Baldwin, D., Boustedt, K., Johansson, A., Wennerholm, C., Patterson, D., and Elenius, P., 2000, “Flip Chip Processing of Lead-Free Solders and Halogen-Free High Density Microvia Substrates,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1101–1105.
Korhonen, T., Su, P., Hong, S., Korhonen, M., and Li, C., 2000, “Under Bump Metallizations for Lead Free Solders,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1106–1110.
Zama, S., Baldwin, D., Hikami, T., and Murata, H., 2000, “Flip Chip Interconnect Systems Using Wire Stud Bumps and Lead Free Solder,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1111–1117.
Takeda, S., and Masuko, T., 2000, “Novel Die Attach Films Having High Reliability Performance for Lead-free Solder and CSP,” Proceedings of IEEE Electronic Components & Technology Conference, May, pp. 1616–1622.
Lau, J. H., and Pan, S., 2000, “Creep Behaviors of Flip Chip on Board with 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints,” Proceedings of IMAPS Microelectronics Conference, Sept.
Lau,  J. H., and Chang,  C., 2000, “Overview of Microvia Technologies,” Circuit World, 26, No. 2, Jan., pp. 22–32.
Lau, J. H., and Lee, W-S. R., 2001, Microvias for Low Cost, High Density Interconnects, McGraw-Hill, New York, NY.
ANSYS User’s Manual, Release 5.6.1, 2111.

Figures

Grahic Jump Location
Schematic of a chip with pad redistribution
Grahic Jump Location
Schematic of one-half of the WLCSP assembly
Grahic Jump Location
Dimensions of the solder joint
Grahic Jump Location
Finite element model of one-half of the WLCSP assembly
Grahic Jump Location
Creep constitutive relations of the lead-free solders
Grahic Jump Location
Thermal cycling condition
Grahic Jump Location
Deformed shapes at 588 sec (a), 4188 sec (b), 7788 sec (c), 11388 sec (d), and 14988 sec (e)
Grahic Jump Location
Effective creep strain contours in the corner solder joint at 588 sec (a), 4188 sec (b), 7788 sec (c), 11388 sec (d), and 14988 sec (e)
Grahic Jump Location
Effective stress contours in the corner solder joint at 588 sec (a), 4188 sec (b), 7788 sec (c), 11388 sec (d), and 14988 sec (e)
Grahic Jump Location
Shear stress and shear creep strain hysteresis loops for 62Sn2Ag36Pb corner solder joint
Grahic Jump Location
Shear stress and shear creep strain hysteresis loops for 96.5Sn3.5Ag corner solder joint
Grahic Jump Location
Shear stress and shear creep strain hysteresis loops for 100In corner solder joint
Grahic Jump Location
Shear stress time-history for 62Sn2Ag36Pb, 96.5Sn3.5Ag, and 100In corner solder joints
Grahic Jump Location
Shear creep strain time-history for 62Sn2Ag36Pb, 96.5Sn3.5Ag, and 100In corner solder joints
Grahic Jump Location
Schematic of WLCSP on PCB with microvia build-up circuits
Grahic Jump Location
Deformed shapes at 588 sec (a), 4188 sec (b), 7788 sec (c), 11388 sec (d), and 14988 sec (e), (build-up PCB)
Grahic Jump Location
Shear stress and shear creep strain hysteresis loops for 62Sn2Ag36Pb corner solder joint on build-up PCB
Grahic Jump Location
Shear stress time-history for 62Sn2Ag36Pb corner solder joint on build-up PCB
Grahic Jump Location
Shear creep strain time-history for 62Sn2Ag36Pb corner solder joint on build-up PCB

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In