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PAPERS ON RELIABILITY

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

[+] Author and Article Information
Cemal Basaran

UB Electronic Packaging Laboratory, University at Buffalo SUNY, Buffalo, NY 14260e-mail: cjb@eng.buffalo.edu

Rumpa Chandaroy

Altair Engineering Inc., Detroit, MI 48071

J. Electron. Packag 124(1), 60-66 (Mar 15, 2001) (7 pages) doi:10.1115/1.1400752 History: Received March 15, 2001
Copyright © 2002 by ASME
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References

Figures

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(a) Comparison of stress versus strain results at different temperatures for strain rate of 1.67×10−3 (b) Comparison of stress versus strain results at different temperatures for strain rate of 1.67×10−4
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(a) Comparison of stress versus strain results at different temperatures for strain rate of 1.0×10−2 (b) Comparison of stress versus strain results at different temperatures for strain rate of 1.0×10−4
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Comparison of cyclic shear stress versus strain results at 25°C
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Comparison of shear stress versus strain results at 22°C and strain rate of 0.003
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A schematic of the SMT package
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Time history of thermal loading
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Time history of dynamic loading
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Shear stress versus strain response for dynamic load of 5g–10Hz in both X and Y directions
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Normal stress versus strain response for dynamic load of 5g–10Hz in both X and Y directions
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Shear stress versus strain response for concurrent thermal and dynamic load 5g–10Hz in both X and Y directions  
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Normal stress versus strain response for concurrent thermal and dynamic load 5g–10Hz in both X and Y directions
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Damage versus number of dynamic cycles for concurrent thermal and dynamic loading of 5g–10Hz in both X and Y directions

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