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TECHNICAL PAPERS

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

[+] Author and Article Information
Chia-Yu Fu

Solid State Research Center, Motorola Labs, 7700 S. River Pkwy, Tempe, AZ 85284

David L. McDowell, I. Charles Ume

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Electron. Packag 124(1), 45-53 (Jan 01, 2001) (9 pages) doi:10.1115/1.1401737 History: Received August 01, 1997; Revised January 01, 2001
Copyright © 2002 by ASME
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References

Fu, C., McDowell, D. L., and Ume, C., 1996, “Thermo-Mechanical Stress Analyses of Plated Through Holes in A PWB Using Internal State Variable Constitutive Models,” Proc. Symposium on Sensing, Modeling and Simulation in Emerging Electronic Packaging Interconnects, ASME WAM, Atlanta, GA.
Oien, M. A., 1976, “Methods for Evaluting Plated Through Hole Reliability,” Proc. of IEEE 14th annual Rel. Phys. Symposium, pp. 129–131.
Nankey,  R, W., 1976, “Thermally Induced Strains in Plated Through Holes in Multilayer Circuit Boards,” IPC, Lincolnwood, IL, Tech. Rep. IPC-TP-121, pp. 1–23.
Vecchio,  K. S., and Hertzberg,  R. W., 1986, “Analysis of Long Term Reliability of Plated-Through Holes in Multilayer Interconnection Boards-Part A: Stress Analysis and Material Characterization,” Microelectron. Reliab., 26, No. 4, pp. 715–732.
Iannuzelli, R. J., 1991, “Predicting Plated-Through-Hole Reliability in High Temperature Manufacturing Processes,” Proc. IEEE 41st ECTC, pp. 410–421.
Barker,  D., Pecht,  M., Dasgupta,  A., and Naqvi,  S., 1991, “Transient Thermal Stress Analysis of A Plated Through Hole Subjected to Wave Soldering,” ASME J. Electron. Packag., 113, No. 2, pp. 149–155.
Liu, S., Mei, Y. H., Zhou, S. G., and Zhu, J. S., 1994, “Effect of Processing Induced Defects on Reliability of Plated Through Holes in PWB,” Proc. ISHM.
Kurosawa,  K., Takeda,  Y., Takaji,  K., and Kawamata,  H., 1981, “An Investigation of the Reliability Behavior of Plated Through Holes in Multilayer Printed Wiring Boards,” IPC, Lincolnwood, IL, Tech. Rep. IPC-TP-385, pp. 1–13.
Sizemore, J. F., 1996, “A Study of the Thermo-mechanical Behavior of A Plated-Through-Hole Under Solder Shock Testing,” M.S. Thesis, School of Mechanical Engineering, Georgia Institute of Technology.
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Fu, C., McDowell, D. L. and Ume, C., 1996, “Time Integration Procedures for a Cyclic Thermoviscoplasticity Model for Pb-Sn Solder Applications,” Proc. IEEE 46th Electronic Components & Technology Conf. (ECTC), Orlando, FL.
Fu,  C., McDowell,  D. L., and Ume,  C., 1998, “A Finite Element Analysis Procedure with a Cyclic Thermoviscoplasticity Model for Pb-Sn Solder and Copper Interconnects,” ASME J. Electron. Packag., 120, No. 1, pp. 1–17.
Marin, E. B., 1994, “A Critical Study of Finite Strain Porous Inelasticity,” Ph.D. thesis, School of Mechanical Engineering, Georgia Institute of Technology.
Marin,  E. B., and McDowell,  D. L., 1997, “A Semi-Implicit Integration Scheme for Rate-Dependent and Rate-Independent Plasticity,” Comput. Struct., 63, No. 3, pp. 579–600.
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Figures

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Cross section of PTHs in a PWB
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Thermal boundary conditions for the transient thermal stress analysis during (a) wave soldering and (b) the subsequent cooling process
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Axisymmetric views of the (a) PTH barrel monitor points B, C, X, Y, and (b) PTH corner monitor points A1, A3, A5, and A7
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Deformations and temperature gradient with heat flux directions of the PTH/PWB during wave soldering, (a) t=0.06/3.00 s, (b) t=2.01/3.00 s, and during subsequent cooling, (c) t=0.06/1000 s, and (d) t=481/1000 s.
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ME strain components of the PTH corner A1, A3, A5, and A7 during wave soldering process (a) radial strain, (b) shear strain, (c) axial strain, and (d) hoop strain components
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ME strain components of the PTH barrel B, C, X, and Y during wave soldering process (a) radial strain, (b) shear strain, (c) axial strain, and (d) hoop strain components
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Stress components of the PTH corner A during wave soldering process (a) radial stress, (b) shear stress, (c) axial stress, and (d) hoop stress components
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Stress components of the PTH barrel B, C, X, and Y during wave soldering process (a) radial stress, (b) shear stress, (c) axial stress, and (d) hoop stress components
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Various strain components at PTH corners A and Z during cooling process (a) radial strain, (b) shear strain, (c) axial strain, and (d) hoop strain components
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Various strain components of PTH barrel B, C, X, and Y during cooling process (a) radial strain, (b) shear strain, (c) axial strain, and (d) hoop strain components
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Stress and ME strain components of PTH corner A for thermal stress analysis subjected to decremental uniform temperature (a) radial strain, (b) shear strain, (c) radial stress, and (d) shear stress components
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Stress and ME strain components of PTH barrel B, C, X, and Y for thermal stress analysis subjected to decremental uniform temperature (a) radial strain, (b) shear strain, (c) radial stress, and (d) shear stress components

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