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TECHNICAL PAPERS

Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages

[+] Author and Article Information
Wen-Hwa Chen, Kuo-Ning Chiang, Shu-Ru Lin

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30043

J. Electron. Packag 124(1), 37-44 (Aug 18, 1999) (8 pages) doi:10.1115/1.1401738 History: Received August 18, 1999
Copyright © 2002 by ASME
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References

Charles,  H. K., and Clatterbaugh,  G. V., 1990, “Solder Joint Reliability—Design Implications from Finite Element Modeling and Experimental Testing,” ASME J. Electron. Packag., 112, No. 2, pp. 135–146.
Lau, J. H., and Rice, D. W., 1986, “Effects of Interconnection Geometry on Mechanical Responses of Surface Mount Component,” Proc., 2nd IEEE International Electronic Manufacturing Technology Symposium, San Francisco, CA, pp. 205–217.
Liotine, F. J., 1988, “The Importance of Solder Volume and Its Control in Reducing Solder Joint Fatigue (For Large TCE Differences),” Surface Mount ’88, SMTA.
Rafanelli,  A. J., 1989, “Solder Fillet Height Criteria for Surface Mounted Chip Components,” ASME J. Electron. Packag., 111, No. 4, pp. 299–302.
Shah,  M. K., 1990, “Analysis of Parameters Influencing Stresses in the Solder Joint of Leadless Chip Capacitors,” ASME J. Electron. Packag., 112, No. 2, pp. 147–153.
Goldmann,  L. S., 1969, “Geometric Optimization of Controlled Collapse Interconnections,” J. IBM Res. Develop, 13, pp. 251–265.
Ohshima, M., Kenmotsu, A., and Ishi, I., 1982, “Optimization of Micro-Solder Reflow Bonding for the LSI Flip Chip,” Proc. 2nd Annual Intl. Electronics Packaging Soc. Conf., pp. 481–488.
Ohshima, M., Satoh, R., Hirota, K., and Ishi, I., 1985, “New MicroSoldering Technology and Its Application to VLSI,” Proc. 1st IEEE CHMT Symposium, CHMT Tokyo ’84, published in Aug., pp. 165–170.
Satoh, R., Ohshima, M., Komura, H., Ishi, I., and Serizawa, K., 1983, “Development of a New Micro-Solder Bonding Method of VLSIs,” Proc. 3rd Annual Intl. Electronics Packaging Soc. Conf., pp. 455–461.
Satoh,  R., Ohshima,  M., Hirota,  K., and Ishi,  I., 1987, “Optimum Bonding Shape Control of Micro-Solder Joint of IC and LSI,” J. Jpn. Inst. Met., 51, No. 6, pp. 553–560.
Katyl,  R. H., and Pimbley,  W. T., 1992, “Shape and Force Relationships for Molten Axisymmetric Solder Connections,” ASME J. Electron. Packag., 114, No. 3, pp. 336–341.
Yost,  B., McGroarty,  J., Borgesen,  P., and Li,  C. Y., 1993, “Shape of a Nonaxisymmetric Liquid Solder Drop Constrained by Parallel Plates,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, pp. 523–526.
Brakke, K. A., 1996, Surface Evolver Manual, Version 2.01. The Geometry Center. University of Minnesota.
Racz,  L. M., and Szekely,  J., 1993, “Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits,” Suri Kagaku, 33, No. 2, pp. 336–342.
Singler,  T. J., Zhang,  X., and Brakke,  K. A., 1996, “Computer Simulation of Solder Bridging Phenomena,” ASME J. Electron. Packag., 118, No. 3, pp. 122–126.
Heinrich,  S. M., Schaefer,  M., Schroeder,  S. A., and Lee,  P. S., 1996, “Prediction of Solder Joint Geometries in Array-Type Interconnects,” ASME J. Electron. Packag., 118, pp. 114–121.
Heinrich,  S. M., Shakya,  S., Wang,  Y., Lee,  P. S., and Schroeder,  S. A., 1996, “Improved Yield and Performance of Ball-Grid-Array Packages: Design and Processing Guidelines for Uniform and Nonuniform Arrays,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 19, No. 2, pp. 310–319.
Chiang,  K. N., and Chen,  W. L., 1998, “Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array,” ASME J. Electron. Packag., 120, pp. 175–178.
Klein Wassink, R. J., 1989, Soldering in Electronics, 2nd ed. Electrochemical Publications Limited.

Figures

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Configuration of Ball Grid Array
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Surface Evolver model of NSMD-SMD (9600 Facets)
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Geometric parameters of NSMD-SMD solder joint: (a) dimensional form; (b) dimensionless form
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Physical limiting profiles corresponding to minimum radius of curvature of meridian (a) concave; (b) convex
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Forces balance for upper pad of NSMD-SMD solder joint
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Standoff height of SMD-SMD solder joint with different copper pad sizes (– Heinrich’s model, — — Surface Evolver)
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Standoff height of NSMD-SMD solder joint with different copper pad sizes (– present model, — — Surface Evolver)
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Standoff height of NSMD-NSMD solder joint with different copper pad sizes (– present model, — — Surface Evolver)
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Comparison of the geometric parameters of SMD-SMD and NSMD-SMD solder joints with different ratio r2/r1(r1=0.35 mm)
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Comparison of the geometric parameters of SMD-SMD and NSMD-NSMD solder joints with different ratio r2/r1(r1=0.35 mm)
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Comparison of the geometric parameters of NSMD-SMD and NSMD-NSMD solder joints with different pad thicknesses (r1=0.35 mm,r2=0.3 mm)
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Comparison of height of NSMD-SMD solder joints with different pad thicknesses (r1=0.35 mm,r2=0.3 mm)

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