0
TECHNICAL PAPERS

Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages

[+] Author and Article Information
Wen-Hwa Chen, Kuo-Ning Chiang, Shu-Ru Lin

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30043

J. Electron. Packag 124(1), 37-44 (Aug 18, 1999) (8 pages) doi:10.1115/1.1401738 History: Received August 18, 1999
Copyright © 2002 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Configuration of Ball Grid Array
Grahic Jump Location
Surface Evolver model of NSMD-SMD (9600 Facets)
Grahic Jump Location
Geometric parameters of NSMD-SMD solder joint: (a) dimensional form; (b) dimensionless form
Grahic Jump Location
Physical limiting profiles corresponding to minimum radius of curvature of meridian (a) concave; (b) convex
Grahic Jump Location
Forces balance for upper pad of NSMD-SMD solder joint
Grahic Jump Location
Comparison of the geometric parameters of NSMD-SMD and NSMD-NSMD solder joints with different pad thicknesses (r1=0.35 mm,r2=0.3 mm)
Grahic Jump Location
Comparison of height of NSMD-SMD solder joints with different pad thicknesses (r1=0.35 mm,r2=0.3 mm)
Grahic Jump Location
Standoff height of SMD-SMD solder joint with different copper pad sizes (– Heinrich’s model, — — Surface Evolver)
Grahic Jump Location
Standoff height of NSMD-SMD solder joint with different copper pad sizes (– present model, — — Surface Evolver)
Grahic Jump Location
Standoff height of NSMD-NSMD solder joint with different copper pad sizes (– present model, — — Surface Evolver)
Grahic Jump Location
Comparison of the geometric parameters of SMD-SMD and NSMD-SMD solder joints with different ratio r2/r1(r1=0.35 mm)
Grahic Jump Location
Comparison of the geometric parameters of SMD-SMD and NSMD-NSMD solder joints with different ratio r2/r1(r1=0.35 mm)

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In