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TECHNICAL PAPERS

Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad

[+] Author and Article Information
Yasuo Takahashi

Joining and Welding Research Institute, Osaka University, 11-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japane-mail: taka@jwri.osaka-u.ac.jp

Michinobu Inoue

Graduate School of Osaka University, Osaka, Japane-mail: michinobu.inoue@toshiba.co.jp

J. Electron. Packag 124(1), 27-36 (Mar 13, 2001) (10 pages) doi:10.1115/1.1413765 History: Received March 13, 2001
Copyright © 2002 by ASME
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References

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Figures

Grahic Jump Location
Schematic illustration for definition of reduction (compression ratio). (a) For flat tool and (b) for groove tool.
Grahic Jump Location
Deformation process of wire and pad for M=10−2o/Ho=0.1,W=9.8 N/mm,T=573 K). (a) ΔH/Ho=0.00%,t=2.00×10−19 s, (b) ΔH/Ho=21.1%,t=8.35×10−5 s, and (c) ΔH/Ho=41.4%,t=1.11×10−2 s.
Grahic Jump Location
Effect of M value on interfacial extension. (a) Segment extension of wire surface and (b) segment extension of pad surface.
Grahic Jump Location
Purpose and policy of the present study
Grahic Jump Location
Models of wire bonding. (a) by flat tool and (b) by V groove tool.
Grahic Jump Location
Effect of M value on stress distribution at ΔH/Ho≈47% (W=9.8 N/mm,T=573 K,δo/Ho=0.1). (a) M=1 and (b) M=10−2.
Grahic Jump Location
Mesh pattern in cross section of wire and pad. (a) For flat tool and (b) for V groove tool.
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Definition of segment number. (a) Ns1 on wire surface and (b) Ns2 on pad and Ns3 on Si-substrate.
Grahic Jump Location
Stress distribution on interfaces. (a) Between wire and pad and (b) between pad and substrate.
Grahic Jump Location
Deformation process in wire bonding by groove (M=1.0,δo/Ho=0.1). (a) ΔH/Ho=0.00%, (b) ΔH/Ho=20.4%, (c) ΔH/Ho=29.8%, and (d) ΔH/Ho=35.9%.
Grahic Jump Location
Flow chart of computer simulation
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Folding process of wire to pad surface. Black circles are the nodal points. Nodal point 1 is the junction between wire and pad and point 2 is on the wire surface. Points 3 and 4 are on the pad surface. White circles are the positions of the nodal points immediately after point 2 touches with point 3 (when the y coordinate of point 2 is equal to that of point 3). A new node as a new junction between wire and pad is made from points 2′ and 3′ .
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Schematic illustration of relative size change between wire diameter and pad thickness
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Effect of shape on interfacial extension. (a) Segment extension of wire surface and (b) segment extension of pad surface.
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Comparison between experimental and calculated results concerning Al wire bonding. (a) Experimental result and (b) calculated result. In (a), wire: Al wire of 300 μm, Pad: Al-Si thin film. Wb=600gf/wire,t=150ms. In (b), wire material: Al, pad material: M=10−2,T=423 K,Wb=14.7 N/mm,t=150 ms and δo/Ho=0.1 were assumed.
Grahic Jump Location
Distribution of equivalent stress in the cross section of wire deformed by groove tool. ΔH/Ho=36%(wire diameter:10μm),Wb=15.68 N/mm,T=573 K,M=1.0 and Material: Au.
Grahic Jump Location
Deformed patterns for δo/Ho=0.1 (Ho=10 μm,M=1.0). The bonding load per unit length of wire is Wb=9.8 N/mm, the bonding pressure, P(=Wb/Ho)=980 MPa and the bonding temperature T=573 K. The number on the top of each figure is the displacement rate value at the top of the wire (point E in Fig. 3(a)). (a) ΔH/Ho=0.00%,t=2.00×10−19 s, (b) ΔH/Ho=21.3%,t=9.35×10−5 s, and (c) ΔH/Ho=39.8%,t=7.85×10−3 s.
Grahic Jump Location
Deformed patterns for δo/Ho=0.5 (M=1.0,Wb=9.8 N/mm,P=980 MPa, and T=573 K). (a) ΔH/Ho=0.00%,t=2.00×10−19 s, (b) ΔH/Ho=18.1%,t=6.10×10−5 s, and (c) ΔH/Ho=40.1%,t=1.17×10−2 s.
Grahic Jump Location
Distribution of equivalent stress in wire and pad at ΔH/Ho≈47% (M=1.0,W=9.8 N/mm,P=980 MPa, and T=573 K). (a) δo/Ho=0.1 and (b) δo/Ho=0.5.
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Effect of pad thickness on interfacial extensions. (a) Segment extension of wire surface and (b) segment extension of pad surface.

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