Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

[+] Author and Article Information
Swapan K. Bhattacharya, Rao R. Tummala

Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, Atlanta, GA 30332-0560

J. Electron. Packag 124(1), 1-6 (Jan 12, 2001) (6 pages) doi:10.1115/1.1400751 History: Received June 29, 1999; Revised January 12, 2001
Copyright © 2002 by ASME
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A transmission electron micrograph of PMN-PT particles at 10,000X
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Scanning electron micrographs of the surface of Shipley epoxy composite material at 29 volume percent loading (a) 3000X, (b) 10,000X
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ESEM micrographs of in-situ thermal curing of a Probimer 4959 (filler loading, 50 vol percent) composite at different temperatures; (a) 20°C, (b) 85°C, (c) 120°C, (d) 217°C
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Dielectric constant versus filler loading in epoxy composite systems
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Dielectric constants as a function of frequency in Shipley XP9500CC composites with two different filler loadings
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Capacitance as a function of temperature in Shipley epoxy composites at 24 vol percent loading
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Dielectric loss as a function of temperature in Shipley epoxy composites at 24 vol percent loading
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Thermal aging of Probimer 4959 composites at 85°C and 85 percent relative humidity up to 1050 hrs at various filler loadings. Capacitors have different electrode areas.
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Cross-sectional view of the Packaging Research Center’s SLIM prototype demonstration vehicle




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