A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

[+] Author and Article Information
Ron S. Li

Automotive and Industrial Electronics Group, Integrated Electronic Systems Sector, Motorola Inc., 4000 Commercial Avenue, Northbrook, IL 60062

J. Electron. Packag 123(4), 394-400 (May 06, 1999) (7 pages) doi:10.1115/1.1372318 History: Received May 06, 1999
Copyright © 2001 by ASME
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Cumulative damage as a function of input vibration level
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Power spectral density of bending stresses of the corner lead (Pa2 /Hz)
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Solder joint stresses of the corner lead from the 3-D local model (N/m2 )
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Stresses of the corner lead from the 3-D local model (N/m2 )
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Displacement solutions on the maximum-stress lead from the system level model
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Failure mode of the microprocessor component
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Maximum lead stresses occur on the corner lead near the component body side
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Contours of the RMS accelerations obtained from FEA
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Transfer function at the center of the PCB board
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Vibration excitation profile used in FEA simulation and vibration experiment
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Gull-wing lead detailed joint model
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A system level model for the 160 pin gull-wing lead microprocessor
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System level model with multiple components
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Flowchart of the stress and reliability analysis




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