A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

Ron S. Li

doi:10.1115/1.1372318

Journal of Electronic Packaging | Volume 123 | Issue 4 | PAPERS ON RELIABILITY

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PAPERS ON RELIABILITY

A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

Ron S. Li

[+] Author and Article Information

Ron S. Li

Automotive and Industrial Electronics Group, Integrated Electronic Systems Sector, Motorola Inc., 4000 Commercial Avenue, Northbrook, IL 60062

J. Electron. Packag 123(4), 394-400 (May 06, 1999) (7 pages) doi:10.1115/1.1372318 History: Received May 06, 1999

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Li RS. A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load. ASME. J. Electron. Packag. 1999;123(4):394-400. doi:10.1115/1.1372318.

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A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

References

Figures

Flowchart of the stress and reliability analysis

System level model with multiple components

A system level model for the 160 pin gull-wing lead microprocessor

Gull-wing lead detailed joint model

Vibration excitation profile used in FEA simulation and vibration experiment

Transfer function at the center of the PCB board

Contours of the RMS accelerations obtained from FEA

Maximum lead stresses occur on the corner lead near the component body side

Failure mode of the microprocessor component

Displacement solutions on the maximum-stress lead from the system level model

Stresses of the corner lead from the 3-D local model (N/m2 )

Solder joint stresses of the corner lead from the 3-D local model (N/m2 )

Power spectral density of bending stresses of the corner lead (Pa2 /Hz)

Cumulative damage as a function of input vibration level

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