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ADDITIONAL TECHNICAL PAPERS

Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly

[+] Author and Article Information
Ruijun Chen, Daniel F. Baldwin

Advanced Assembly Process Technology—AdAPT Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 123(4), 388-393 (Nov 01, 2000) (6 pages) doi:10.1115/1.1371926 History: Received July 06, 2000; Revised November 01, 2000
Copyright © 2001 by ASME
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References

Figures

Grahic Jump Location
Attachment site mismatches due to transverse displacements of the flexible substrate
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Dimensionless max deflections of square plates subject to dimensionless point loads (*mixed support refers to two adjacent edges clamped and the opposite edges simply supported)
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Comparisons among the displacements of the Polyimide substrate predicted by either the von Karman theory or the transverse displacement model in Eq. (2)
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Prediction errors in percent of flexible plate displacements subject to a typical assembly loads

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