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ADDITIONAL TECHNICAL PAPERS

Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

[+] Author and Article Information
Katsuhiko Sasaki

Division of Mechanical Science, Hokkaido University, N13, W8, Kita-ku, Sapporo, 060-8628 Japane-mail: katsu@eng.hokudai.ac.jp

Ken-ichi Ohguchi

Department of Materials, Akita University, 1-1 Tegatagakuencho, Akita, 010-8502 Japan

Hiromasa Ishikawa

Division of Mechanical Science, Hokkaido University, Sapporo, Japan

J. Electron. Packag 123(4), 379-387 (Aug 24, 1999) (9 pages) doi:10.1115/1.1371927 History: Received August 24, 1999
Copyright © 2001 by ASME
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References

Shine, M. C., and Fox, L. R., 1988, “Fatigue of Solder Joints in Surface Mount Devices,” Low-Cycle Fatigue, ASTM STP 942, H. D. Solomon et al., eds., ASTM, Philadelphia, Pa, pp. 588–610.
Solomon,  H. D., 1989, “Strain-Life Behavior in 60/40 Solder,” ASME J. Electron. Packag., 111, pp. 75–82.
Satoh,  R., Arakawa,  K., Harada,  M., and Matsui,  K., 1991, “Thermal Fatigue Life of Pb-Sn Alloy Interconnections,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 14, No.1, pp. 224–231.
Pao,  Y.-H., Govila,  R., Badgley,  S., and Jih,  E., 1993, “An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints,” ASME J. Electron. Packag., 115, pp. 1–8.
Vaynman,  S., and McKeown,  S.-A., 1993, “Energy-Based Methodology for Fatigue Life Prediction of Solder Materials,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, pp. 317–322.
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Ishikawa,  H., Sasaki,  K., and Ohguchi,  K., 1996, “Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity,” ASME J. Electron. Packag., 118, pp. 164–169.
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Bhatti,  P. K., Gschwend,  K., Kwang,  A. Y., and Syed,  R. A., 1995, “Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Device,” ASME J. Electron. Packag., 117, pp. 20–25.
Ling,  S., and Dasgupta,  A., 1997, “A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis,” ASME J. Electron. Packag., 119, pp. 177–182.
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Figures

Grahic Jump Location
Stress-strain relations of pure tension, (a) Strain rate effect on pure tension at 303 K; (b) temperature effect on the pure tension at a strain rate of 0.1 percent/s
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Limiting stresses of cyclic tension-compression loading, (a) The stress-strain relation of the cyclic tension-compression (strain amplitude=0.5 percent,strain rate=0.001percent/s,temperature=303 K); (b) limiting stresses of cyclic tension-compression and of pure tension
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Strain rate ε̇t versus limiting stress σlim relations
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Simulated stress-strain relations of pure tension, (a) Strain rate effect on pure tension at 303 K; (b) temperature effect on the pure tension at a strain rate of 0.1 percent/s
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Simulated stress-strain relations of cyclic tension-compression loading, (a) Strain rate effect on cyclic loading (strain amplitude=0.5 percent,temperature=303 K); (b) temperature effect on cyclic loading (strain amplitude=0.5 percent,strain rate=0.1 percent/s)
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Simulated creep curves, (a) At 303 K; (b) at 323 K; (c) at 343 K
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Pure tension with changes in the strain rate
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Cyclic tension-compression loading with a strain rate of 0.01 percent/s on the tensile side and 0.001 percent/s on the compressive side, (a) Experiment; (b) simulation
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Cyclic tension-compression loading at a strain rate of 0.01 percent/s for |εt|<0.2 percent and 0.001 percent/s for |εt|≥0.2 percent, (a) Experiment; (b) simulation
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Creep after cyclic tension-compression loading, (a) Experiment; (b) simulation
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Experimental results and simulation of creep after cyclic tension-compression

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