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ADDITIONAL TECHNICAL PAPERS

Thermal Math Modeling and Analysis of an Electronic Assembly

[+] Author and Article Information
K. N. Shukla

Vikram Sarabhai Space Center, Trivandrum 695022, India

J. Electron. Packag 123(4), 372-378 (May 05, 2000) (7 pages) doi:10.1115/1.1388561 History: Received May 05, 2000
Copyright © 2001 by ASME
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References

Bar-Cohen, A., Kraus, A. D., and Davidson, S. E., 1983, “Thermal Frontiers in the Design and Packaging of Microelectronic Equipment,” Mech. Eng. (Am. Soc. Mech. Eng.), pp. 53–59.
Kraus, A. D., and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere, Washington, D.C.
Bar-Cohen, A., and Kraus, A. D., 1993, Advances in Thermal Modeling of Electronic Components and Systems, Vol. 3, ASME Press, New York.
Baum, J. R., 1969, Thermal Design Consideration for Packaging Electronic Equipment in Handbook of Electronic Packaging, Harper, C. A., ed., McGraw-Hill, New York.
Frank, L. E., 1985, “CINDA Enhancement at Hughes for Cryogenic Thermal Studies,” AIAA Paper-0085.
Frank, L. E., 1985, “CINDA Enhancement at Hughes for High Power density Electronic Packaging, in Heat Transfer in Electronic Equipment,” ASME Book GOO 305.
Ishimoto, T., and Fink, I. C., 1971, “System Improvement Numerical Differencing Analyser (SINDA),” Engineering Program Manual, Contract NAS=9-10435/14690-H002-RO-02, TRW Systems Group.
Cook,  K. B., Kerns,  D. V., Nagle,  H. T., Slagh,  T. D., and Ruwe,  V. W., 1976, “Computer aided Thermal Analysis of a Hybrid Multilayer active Band pass Filter/Amplifier,” IEEE Trans Parts, Hybrids and Packaging,PHP-12, pp. 344–350.
Hein, V. L., and Lenzi, V. K., 1969, “Thermal Analysis of Substrates and Integrated Circuits,” presented at the 1969 Electronic Component Conference.
Ellison,  G. N., 1976, “The Thermal Design of an LSI Single Chip Package,” IEEE Trans Parts, Hybrids and Packaging,PHP-12, pp. 371–378.
Nagurny, N. J., 1989, “Thermal modeling and testing of surface mounted components on conduction cooled military standard electronic modules,” Proceedings of the 9th International Electronic Packaging Society Conference, pp. 375–384.
Quin, B., and Chi, J., 1992, “Finite layer spectral method for thermal analyses of layered printed circuit boards,” Proceedings of Inter Society Conference on Thermal Phenomena in Electronic Systems, pp. 170–176.
Rastogi,  S. K., and Poulikakos,  D., 1993, “Modeling of Heat Transfer in the surface mounting of Electronic Components,” ASME J. Electron. Packag., 115, pp. 373–381.
Shukla,  K. N., Chacko,  M. J., and Mani,  L., 1994, “Thermal Management of Electonic Packages for Space Applications,” Heat Transfer Eng., 11, pp. 27–44.
Luikov, A. V., 1968, Analytical Heat Diffusion Theory, Academic Press, New York.
Sparrow,  E. M., Neilhammer,  J. E., and Choboki,  A., 1982, “Heat Transfer and Pressure Drop Characteristics of Arrays of Rectangular Modules Encountered in Electronic Equipment,” Int. J. Heat Mass Transf., 25, pp. 961–973.
Kreith, F., 1969, Principles of Heat Transfer, International Text Book Company, PA.

Figures

Grahic Jump Location
Temperature contour of PCB for the 3 discrete heat sources (finite element method)
Grahic Jump Location
Average temperature of the lower plate
Grahic Jump Location
Temperature contour on the PCB for the 3 discrete sources
Grahic Jump Location
Steady-state temperature profile for multiple heat sources (interchange of the packages)
Grahic Jump Location
Steady-state temperature profile for multiple heat sources
Grahic Jump Location
Average temperature drop of the PCB, K
Grahic Jump Location
Schematic of an idealized substrate

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