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ADDITIONAL TECHNICAL PAPERS

Thermal Math Modeling and Analysis of an Electronic Assembly

[+] Author and Article Information
K. N. Shukla

Vikram Sarabhai Space Center, Trivandrum 695022, India

J. Electron. Packag 123(4), 372-378 (May 05, 2000) (7 pages) doi:10.1115/1.1388561 History: Received May 05, 2000
Copyright © 2001 by ASME
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References

Figures

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Schematic of an idealized substrate
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Average temperature drop of the PCB, K
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Steady-state temperature profile for multiple heat sources
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Steady-state temperature profile for multiple heat sources (interchange of the packages)
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Temperature contour on the PCB for the 3 discrete sources
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Temperature contour of PCB for the 3 discrete heat sources (finite element method)
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Average temperature of the lower plate

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