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ADDITIONAL TECHNICAL PAPERS

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

[+] Author and Article Information
Dagmar Beyerlein

Department of Mechanical Engineering, Santa Clara University, 74 Mountain Spring Ave., San Francisco, CA 94114e-mail: dbeyerle@guidant.com

Lee E. Hornberger

Department of Mechanical Engineering, Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053e-mail: lhornberger@scu.edu

J. Electron. Packag 123(4), 366-371 (Feb 06, 2001) (6 pages) doi:10.1115/1.1388562 History: Received February 06, 2001
Copyright © 2001 by ASME
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References

Electronic Trends Publications, 1999 “The Worldwide IC Packaging Market.”
Han,  S., and Wang,  K., 1995, “A Study on Wire Sweep ion Encapsulation of Semiconductor Chips Using Simulated Experiments,” ASME J. Electron. Packag., 117, pp. 178–184.
Pecht, M., Dasgupta, A., and Evans, J., 1994, Quality Conformance and Qualification of Microelectronic Packages and Interconnects, Wiley, New York.
Nguyen, L. T., Danker, A. S, Santhiran, N., and Shervin, C. R., 1992, “Flow Modeling of Wire Sweep During Molding of Integrated Circuits,” Proceedings, ASME Winter Annual Meeting, Anaheim, CA, pp. 27.
Nguyen, L. T., and Lim, F. J., 1990, “Wire Sweep During Molding of Integrated Circuits,” Proceedings, Electronic Components and Technology Conference, IEEE, pp. 777–785.
Cypress Semiconductor, 1998.
Hieber, C. A., 1987, Injection and Compression Modeling Fundamentals, Marcel Dekker, New York.
Kamal, M. R., Sourour, S., and Ryan, M., 1973, “Integrated Thermo-Rheological Analysis of the Cure of Thermosets,” Proceedings, 31st SPE ANTEC, Montreal, Canada.
Han, S., and Wang, K. K. 1995, “Flow Analysis in a Cavity with Leadframe During Semiconductor Chip Encapsulation,” Proceedings, International Intersociety Electronic Packaging Conference, Lahaina, Hawaii.
Advancd CAE Technology, 1997, C-Mold Microchip Encapsulation User’s Guide, Ithaca, New York.
Bird, R., Armstrong, R., and Hassager, O., 1987, Dynamics of Polymeric Liquids, Vol. 1 , Wiley-Interscience, New York.
Huebner, K., and Thornton, E., 1987, The Finite Element Method for Engineers Wiley, New York.
Nguyen, S., 1998, Advanced CAE Technology, Ithaca, New York.
Advanced CAE Technology, 1997, C-Mold Design Guide, Ithaca, New York.
Berins, M. L., 1991, Plastics Engineering Handbook, Society of the Plastics Industry, ed., 5th edition, Van Nostrand Reinhold, New York.

Figures

Grahic Jump Location
Leadframe-mounted TSOP architecture
Grahic Jump Location
96-cavity TSOP model layout
Grahic Jump Location
180-cavity/PTP TSOP mold layout
Grahic Jump Location
Finite element model of 96-cavity mold
Grahic Jump Location
Finite element model of 180-cavity mold

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