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ADDITIONAL TECHNICAL PAPERS

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

[+] Author and Article Information
Dagmar Beyerlein

Department of Mechanical Engineering, Santa Clara University, 74 Mountain Spring Ave., San Francisco, CA 94114e-mail: dbeyerle@guidant.com

Lee E. Hornberger

Department of Mechanical Engineering, Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053e-mail: lhornberger@scu.edu

J. Electron. Packag 123(4), 366-371 (Feb 06, 2001) (6 pages) doi:10.1115/1.1388562 History: Received February 06, 2001
Copyright © 2001 by ASME
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References

Figures

Grahic Jump Location
Leadframe-mounted TSOP architecture
Grahic Jump Location
96-cavity TSOP model layout
Grahic Jump Location
180-cavity/PTP TSOP mold layout
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Finite element model of 96-cavity mold
Grahic Jump Location
Finite element model of 180-cavity mold

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