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ADDITIONAL TECHNICAL PAPERS

Experimental Evaluation of Air-Cooling Electronics at High Altitudes

[+] Author and Article Information
Henry Wong

Motorola Computer Group, 2900 S. Diablo Way, Tempe, AZ 85282

Robert E. Peck

Department of Mechanical and Aerospace Engineering, Arizona State University, Tempe, AZ 85287

J. Electron. Packag 123(4), 356-365 (Dec 20, 1999) (10 pages) doi:10.1115/1.1392319 History: Received December 20, 1999
Copyright © 2001 by ASME
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References

Hall, D. A., 1989, “Prediction of Electronic Component Temperatures at High Altitude Using Low Altitude Measurements,” Proceeding Fifth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 121–124.
Mansuria, M. S., 1994, “Estimation of System Internal Air and Component Surface Temperatures at High Altitudes, Temperatures and Relative Humidity,” Proceedings of the 1994 International Electronics Packaging Conference, pp. 122–130.
Steinberg, D. S., 1991, Cooling Techniques for Electronic Equipment, Wiley, New York.
Vogel, M. R., 1996, “Thermal Performance of Air-Cooled Hybrid Heat Sinks for a Low Velocity Environment,” Proceedings of the Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 111–121.
Belady, C. L., 1996, “Design Considerations for Air Cooling Electronic Systems in High Altitude Conditions,” Proceedings of the Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, Austin, pp. 111–121.
Faghri, M., Molki, M., and Asako, Y., 1996, “Air Cooling Technology for Electronic Equipment,” Chapter 2, Entrance Design Correlations for Circuit Boards in Forced-Air Cooling, CRC Press, Boca Raton, pp. 47–80.
Wirtz, R. A., 1996, “Air Cooling Technology for Electronic Equipment,” Chapter 3, Forced Cooling of Low-Profile Package Arrays, CRC Press, Boca Raton, pp. 81–101.
Arvizu, D. E., and Moffat, R. J., 1982, “The Use of Superposition in Calculating Cooling Requirements for Circuit Board Mounted Electronic Components,” IEEE Proceedings of the 32nd Electronic Components Conference, San Diego, pp. 133–144.
Moffat,  R. J., and Anderson,  M. J., 1990, “Applying Heat Transfer Coefficient Data to Electronics Cooling,” ASME J. Heat Transfer, 112, pp. 882–890.
Anderson,  A. M., and Moffat,  R. J., 1992, “The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1 - Data for Arrays of Flatpacks for Different Flow Conditions,” ASME J. Electron. Packag., 114, pp. 14–21.
Anderson,  A. M., and Moffat,  R. J., 1992, “The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 2 - Modeling Flatpack Data as a function of Channel Turbulence,” ASME J. Electron. Packag., 114, pp. 22–28.
Wong, H., 1999, “Experimental Investigation of Air Cooling Electronics at High Altitudes,” Master’s thesis Arizona State University, Arizona.
Azar, K., 1997, Experimental Techniques in Electronic Cooling, CRC Press, Boca Raton, FL.
Anderson,  A. M., 1997, “A Comparison of Computational and Experimental Results for Flow and Heat Transfer From an Array of Heated Blocks,” ASME J. Electron. Packag., 119, pp. 32–39.
Anderson,  A. M., 1994, “Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient,” ASME J. Electron. Packag., 116, pp. 310–316.
Telecordia GR-63-CORE Issue 1, 1995, “Network Equipment-Building System (NEBS) Requirements: Physical Protection,” Bellcore.

Figures

Grahic Jump Location
Representative flow pattern in PCB channel
Grahic Jump Location
Representative flow pattern in PCB channel
Grahic Jump Location
(a) had and (b) θ at 0 m ASL
Grahic Jump Location
(a) had and (b) θ at 1000 m ASL
Grahic Jump Location
(a) had and (b) θ at 2000 m ASL
Grahic Jump Location
(a) had and (b) θ at 3000 m ASL
Grahic Jump Location
(a) had and (b) θ at 4000 m ASL
Grahic Jump Location
(a) had and (b) θ at 5000 m ASL
Grahic Jump Location
Comparison of had at sea level (3 m/s)
Grahic Jump Location
Comparison of θ at sea level (3 m/s)
Grahic Jump Location
Relative contribution of component temperature

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