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ADDITIONAL TECHNICAL PAPERS

Experimental Evaluation of Air-Cooling Electronics at High Altitudes

[+] Author and Article Information
Henry Wong

Motorola Computer Group, 2900 S. Diablo Way, Tempe, AZ 85282

Robert E. Peck

Department of Mechanical and Aerospace Engineering, Arizona State University, Tempe, AZ 85287

J. Electron. Packag 123(4), 356-365 (Dec 20, 1999) (10 pages) doi:10.1115/1.1392319 History: Received December 20, 1999
Copyright © 2001 by ASME
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References

Figures

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Representative flow pattern in PCB channel
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Representative flow pattern in PCB channel
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(a) had and (b) θ at 0 m ASL
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(a) had and (b) θ at 1000 m ASL
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(a) had and (b) θ at 2000 m ASL
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(a) had and (b) θ at 3000 m ASL
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(a) had and (b) θ at 4000 m ASL
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(a) had and (b) θ at 5000 m ASL
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Comparison of had at sea level (3 m/s)
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Comparison of θ at sea level (3 m/s)
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Relative contribution of component temperature

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