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Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder

[+] Author and Article Information
V. Stolkarts, L. M. Keer

Department of Civil Engineering, Northwestern University, 2145 Sheridan Road, Evanston, IL 60208-3109  

M. E. Fine

Department of Materials Science and Engineering, Northwestern University, 2225 North Campus Drive, Evanston, IL 60208-3109e-mail: m-fine@nwu.edu

J. Electron. Packag 123(4), 351-355 (Feb 23, 2000) (5 pages) doi:10.1115/1.1407825 History: Received February 23, 2000
Copyright © 2001 by ASME
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References

Bodner,  S. R., and Partom,  Y., 1975, “Constitutive Equations for Elastic-Viscoplastic Strain-Hardening Materials,” ASME J. Appl. Mech., 42, pp. 385–389.
Knecht,  S., and Fox,  L. R., 1990, “Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 13, No. 2, pp. 424–433.
McDowell, D. L., Miller, M. P., and Brooks, D. C., 1994, “A Unified Creep-Plasticity Theory for Solder Alloys,” Fatigue of Electronic Materials, ASTM STP 1153, S. A. Schroeder and M. R. Mitchell, eds., American Society for Testing and Materials, Philadelphia, pp. 42–59.
Chaboche, J. L., 1996, “Unified Cyclic Viscoplastic Constitutive Equations: Development, Capabilities, and Thermodynamic Framework,” Unified Consti-tutive Laws of Plastic Deformation, A. S. Krausz and K. Krausz, eds., Academic Press, pp. 1–68.
Skipor,  A. F., Harren,  S. V., and Botsis,  J., 1996, “On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder,” ASME J. Eng. Mater. Technol., 118, pp. 1–11.
Stolkarts,  V., Keer,  L. M., and Fine,  M. E., 1999, “Damage Evolution Governed by Microcrack Nucleation with Application to the Fatigue of 63Sn-37Pb Solder,” J. Mech. Phys. Solids, 47, pp. 2451–2468.
Kocks, U. F., 1987, “Constitutive Behavior Based on Crystal Plasticity,” Unified Constitutive Equations for Creep and Plasticity, A. K. Miller, ed., pp. 1–88, Elsevier Applied Science, New York.
Flugge, S., 1973, Encyclopedia of Physics, Vol. 1, Mechanics of Solids 1, C. Truesdell, ed., Springer-Verlag, New York, p. 389.
Cutiongco, E., 1991, Fatigue of a Near-Eutectic Lead-Tin Solder Alloy for Surface Mount Technology, Ph.D. dissertation, Northwestern University, Evanston, IL.
Budiansky,  B., and O’Connell,  R. J., 1976, “Elastic Moduli of a Cracked Solid,” Int. J. Solids Struct., 12, pp. 81–97.
Cortez, R., 1992, Mixed-Mode Fatigue and Fatigue Damage Mechanisms of Tin-Lead Solder Alloys, Ph.D. dissertation, Northwestern University, Evanston, IL.

Figures

Grahic Jump Location
Variation in power n with strain rate
Grahic Jump Location
Model simulation of the first cycle at 0.6 percent strain range, 1 s ramp time and 25°C temperature
Grahic Jump Location
Model simulation of the first cycle at 0.6 percent strain range, 10 s ramp time and 25°C temperature
Grahic Jump Location
Model simulation of the first cycle at 0.6 percent strain range, 60 s ramp time and 25°C temperature
Grahic Jump Location
Model simulation of the first cycle at 0.6 percent stain range, 1 s ramp time and 50°C temperature
Grahic Jump Location
Model simulation of the first cycle at 0.6 percent strain range, 1 s ramp time and 65°C temperature
Grahic Jump Location
Model simulation of the first cycle at 0.6 percent strain range, 1 s ramp time and 80°C temperature
Grahic Jump Location
Model simulation of the first cycle at 0.95 percent strain range, 1 s ramp time and 25°C temperature
Grahic Jump Location
Model simulation of the first cycle at 1.0 percent strain range, 1 s ramp time, 60 s hold and 25°C temperature
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Model simulation of the thermomechanical loading cycle at 1.14 percent strain amplitude, 120 s ramp time and 25°C–80°C temperature range
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A typical damage evolution curve in a strain controlled cycling of 63Sn-37Pb solder

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