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SPECIAL SECTION ON THERMINIC

Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design

[+] Author and Article Information
Mohamed-Nabil Sabry

Mechanical Engineering Department, Mansoura University/ Mentor Graphics Egypt, 51, Beirut St., Heliopolis, Cairo, Egypte-mail: nabil_sabry@mentor.com

J. Electron. Packag 123(4), 344-350 (Mar 21, 2001) (7 pages) doi:10.1115/1.1390342 History: Received March 21, 2001
Copyright © 2001 by ASME
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References

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Figures

Grahic Jump Location
Use of micro-channels to cool electronic circuits
Grahic Jump Location
Isothermal contours for Sa=10,A=0.05,m=1 (a) fin temperature Ts; (b) fluid temperature Tf; (c) Ts−Tf
Grahic Jump Location
Isothermal contours for Sa=10,A=0.1,m=1 (a) fin temperature Ts; (b) fluid temperature Tf; (c) Ts−Tf
Grahic Jump Location
Isothermal contours for Sa=10,A=1,m=1 (a) fin temperature Ts; (b) fluid temperature Tf; (c) Ts−Tf
Grahic Jump Location
Dependence of fluid thermal resistance Rf on Sa, A, m

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