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SPECIAL SECTION ON THERMINIC

IGBT Package Design for High Power Aircraft Electronic Systems

[+] Author and Article Information
Farhad Sarvar, David C. Whalley, Ming K. Low

Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leics, LE11 3TU, United Kingdom

J. Electron. Packag 123(4), 338-343 (Sep 03, 2001) (6 pages) doi:10.1115/1.1390341 History: Received September 03, 2001
Copyright © 2001 by ASME
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References

Young, R. M. K., Newcombe, D., and Sarvar F., 1999, “Design Factors in Optimization of IGBT Power Module Heatsinks,” Proceedings, Power Conversion and Intelligent Motion Conference, pp 653-659, ISBN 3-928643-22-3.
Rujano, J. R. et al., 1998, “Development of a Thermal Management Solution for a Ruggedized Pentium Based Notebook Computer,” Proceedings, The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm-98, Seattle, USA, pp 8–14.
Scott, A. W., 1974, Cooling of Electronic Equipment, J Wiley, New York.
Steinburg, D. S., 1991, Cooling Techniques for Electronic Equipment, Second Edition, J Wiley, New York.
Ellison, G. N., 1984, Thermal Computations for Electronic Equipment, Van Nostrand, New York.
Ogunjimi, A. O., Whalley, D. C., and Williams, D. J., 1993, “A Comparison of Modeling Methods for Electronic Interconnect Structures,” Proceedings, 43rd IEEE Components, Hybrids and Manufacturing Technology Conference, IEEE, Orlando, pp 871–876.
Whalley, D. C., 1988, “Thermal Modeling Techniques for Electronic Assemblies,” Lucas Industries report no. LR 96 309.
Zhang,  Li, , 1999, “The Accuracy of Structural Approximations Employed in Analysis of Area Array Packages,” IEEE Trans. CPMT: CPT, 22, No 4, pp 525–533.
Sarvar, F., and Whalley, D. C., 1999, “Heatsink Design for High Power Aircraft Electronic Systems,” Proceedings, Interpack 99, Int. Intersociety ASME/JSME/IEEE Electronic Packaging Conf., Westin Mauii, Hawaii, USA, pp 2015-2021, ISBN 0-7918-1612-5.
ARINC Specification 600, prepared by the Airlines Electronic Engineering Committee, Published by Aeronautical Radio Inc., Maryland, 1987.

Figures

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A traditional power semiconductor package and heatsink
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An integrated heatsink power semiconductor package
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Diagram showing a typical plate-fin heatsink
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Axisymmetric representation of an IGBT structure
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2D axisymmetric FE model of an IGBT heatsink structure
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Heatsink weight as function of switching frequency
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Contour map showing the predicted steady-state temperatures within the module
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Predicted maximum junction temperature during a transient overload
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Predicted max steady-state junction temperature as a function of baseplate thickness
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Temperature distribution over a 3D FE model of the 8-chip in line IGBT heatsink structure
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Steady-state temperature distribution for a fully staggered 12-chip IGBT heatsink layout
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Steady-state temperature distribution for a fully staggered 10 chip module
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Temperature profile of 10 IGBT module during a 5 second power transient

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