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SPECIAL SECTION ON THERMINIC

IGBT Package Design for High Power Aircraft Electronic Systems

[+] Author and Article Information
Farhad Sarvar, David C. Whalley, Ming K. Low

Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leics, LE11 3TU, United Kingdom

J. Electron. Packag 123(4), 338-343 (Sep 03, 2001) (6 pages) doi:10.1115/1.1390341 History: Received September 03, 2001
Copyright © 2001 by ASME
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References

Figures

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A traditional power semiconductor package and heatsink
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An integrated heatsink power semiconductor package
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Diagram showing a typical plate-fin heatsink
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Axisymmetric representation of an IGBT structure
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2D axisymmetric FE model of an IGBT heatsink structure
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Heatsink weight as function of switching frequency
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Contour map showing the predicted steady-state temperatures within the module
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Predicted maximum junction temperature during a transient overload
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Predicted max steady-state junction temperature as a function of baseplate thickness
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Temperature distribution over a 3D FE model of the 8-chip in line IGBT heatsink structure
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Steady-state temperature distribution for a fully staggered 12-chip IGBT heatsink layout
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Steady-state temperature distribution for a fully staggered 10 chip module
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Temperature profile of 10 IGBT module during a 5 second power transient

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