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SPECIAL SECTION ON THERMINIC

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

[+] Author and Article Information
K. N. Chiang

C. W. Chang, C. T. Lin

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.

J. Electron. Packag 123(4), 331-337 (May 10, 2001) (7 pages) doi:10.1115/1.1389847 History: Received May 10, 2001
Copyright © 2001 by ASME
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References

Figures

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FCOG with flexible circuit
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ACF package and its electrical conduction mechanism
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FCOG manufacturing processes
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Delamination of adhesive layer of ACA package (Yim and Paik 10)
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Surface contact mechanical and electrical behavior
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Contact pressure versus contact resistance
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Equivalent spring model
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System level equivalent spring model
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Contact force versus displacement
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Contact radius versus contact force
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Typical contact deformation of conductive particle
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Contact resistance versus contact force
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Experimental result of conductive particle
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2D ACA/ACF multiple particles system
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Average contact forces at each step
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3D conductive particle model to 1D equivalent spring model
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Contact force versus Displacement of 3D model
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Manufacturing compressive loading effect
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Environmental temperature versus contact force at two different processing temperatures
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Environmental temperature versus contact force for two different adhesives

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