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SPECIAL SECTION ON THERMINIC

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

[+] Author and Article Information
K. N. Chiang

C. W. Chang, C. T. Lin

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.

J. Electron. Packag 123(4), 331-337 (May 10, 2001) (7 pages) doi:10.1115/1.1389847 History: Received May 10, 2001
Copyright © 2001 by ASME
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References

Hatada, K., and Fujimoto, H., Kawakita, T., and Ochi, T., 1988, “A New LSI Bonding Technology “Micro Bump Bonding Assembly Technology,” IEEE-CHMT Proceeding, pp. 45-49.
Hatada,  K., Fujimoto,  H., Ochi,  T., and Ishida,  Y., 1990, “LED Array Modules by New Technology: Microbump Bonding Method,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 13, No. 3, Sept., pp. 521-527.
Kristiansen, H., and Liu, J., 1997, “Overview of Conductive Adhesive Interconnection Technologies for LCD’s,” PEP’97, IEEE, pp. 223-232.
Liu,  J., 1996, “On the failure mechanism of anisotropically conductive adhesion joints on copper metallization,” Int. J. Adhesion and Adhesives, 16, No. 4, pp. 285-287.
Kristiansen, H., Gulliksen, M., Haugerud, H., and Friberg, R., 1998, “Characterization of Electrical Contacts Made by Non-Conductive Adhesive,” Proceeding of Adhesive Joining and Coating Technology in Electronics Manufacturing 3rd International Conference, Sept. 28–30, 1998, pp. 345-350.
Nicewarner,  E., 1999, “Interconnect resistance characteristics of several flip-chip bumping and assembly techniques,” Microelectron. Reliab., 39, pp. 113-121.
Timsit,  R. S., 1999, “Electrical Contact Resistance: Properties of Stationary Interfaces,” IEEE Trans. Compon., Packag. Technol., Part A, 22, No. 1, Mar., pp. 85-98.
Chiang, K. N., Chang, C. W., and Lin, C. T., 2000, “Analysis of ACA/ACF Package Using Equivalent Spring Method,” Proceeding of EPTC 2000 (IEEE) , Singapore, Dec. pp. 110-116.
Fu,  Y., Wang,  Y., Wang,  X., Liu,  J., Lai,  Z., Chen,  G., and Willander,  M., 2000, “Experimental and Theoretical Characterization of Electrical Contact in Anisotropically Conductive Adhesive,” IEEE Trans. Compon., Packag Manuf. Technol., Part B, 23, No. 1, Feb., pp. 15-21.
Yim,  M. J., and Paik,  K. W., 1999, “The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF),” IEEE Trans. Adv. Packag., 22, No. 2, May, pp. 166-193.

Figures

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FCOG with flexible circuit
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ACF package and its electrical conduction mechanism
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FCOG manufacturing processes
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Delamination of adhesive layer of ACA package (Yim and Paik 10)
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Surface contact mechanical and electrical behavior
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Contact pressure versus contact resistance
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Equivalent spring model
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System level equivalent spring model
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Contact force versus displacement
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Contact radius versus contact force
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Typical contact deformation of conductive particle
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Contact resistance versus contact force
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Experimental result of conductive particle
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2D ACA/ACF multiple particles system
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Average contact forces at each step
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3D conductive particle model to 1D equivalent spring model
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Contact force versus Displacement of 3D model
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Manufacturing compressive loading effect
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Environmental temperature versus contact force at two different processing temperatures
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Environmental temperature versus contact force for two different adhesives

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