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TECHNICAL BRIEFS

Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder

[+] Author and Article Information
J. Zhao, Y. Mutoh

Nagaoka University of Technology, Nagaoka, 940-2188, Japan

T. Ogawa

Aoyama Gakuin University, Setagaya, Tokyo, 157-8572, Japan

J. Electron. Packag 123(3), 311-315 (Mar 17, 1999) (5 pages) doi:10.1115/1.1371780 History: Received March 17, 1999
Copyright © 2001 by ASME
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References

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Figures

Grahic Jump Location
Microstructure of the material used
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Load-strain curve measured using the strain gauge attached on side surface during FCG test at R=0.1,f=10 Hz, ΔK=0.52 MPa m1/2
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Effect of stress ratio on the da/dN−ΔJ curve
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Effect of stress ratio on the da/dN−ΔK curve
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Effect of stress ratio on the da/dN−Kmax curve
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Crack tip of main crack (a) and branched crack (b). (R=0.1).
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Cavities and microcracks ahead of crack tip on side surface of tested specimens; (a) R=0.1, which indicates cavities along grain boundary; (b) R=0.7, which indicates microcracks along grain boundary
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Morphology in the crack tip region at the near-threshold region (R=0.7)
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Fractographies of tested specimens
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Microcracks induced by slip marks (arrow A) and striations (arrow B) on fracture surface of R=0.1

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