Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder

[+] Author and Article Information
J. Zhao, Y. Mutoh

Nagaoka University of Technology, Nagaoka, 940-2188, Japan

T. Ogawa

Aoyama Gakuin University, Setagaya, Tokyo, 157-8572, Japan

J. Electron. Packag 123(3), 311-315 (Mar 17, 1999) (5 pages) doi:10.1115/1.1371780 History: Received March 17, 1999
Copyright © 2001 by ASME
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Plumbridge,  W. J., 1996, “Review Solders in Electronics,” J. Mater. Sci., 31, pp. 2501–2514.
Lau, J. H., 1991, Solder Joint Reliability, Van Nostrand Reinhold, New York.
Logsdon,  W. A., Liaw,  P. K., and Burke,  M. A., 1990, “Fracture Behavior of 63Sn-37Pb Solder,” Eng. Fract. Mech., 36, No. 2,, pp. 183–218.
Solomon, H. D., 1994, “Life Orediction and Accelerated Testing,” The Mechanics of Solder Alloy Interconnects, D. R. Frear et al., eds., Van Nostrand Reinhold, New York, 199-313.
Frear,  D. R., Posthill,  J. B., and Morris,  J. W., 1989, “The Microstructural Details of β-Sn Precipitation in a 5Sn-95Pb Solder Alloy,” Metall. Trans. A, 20A, Aug., pp. 1325–1333.
Vaynman,  S., Fine,  M. E., and Jeannotte,  D. A., 1988, “Isothermal Fatigue of Low Tin Lead Based Solder,” Metall. Trans. A, 19A, Apr., pp. 1051–1059.
Cubberly, William, H., et al., 1979, Metals Handbook Ninth Edition, Vol. 2, American Society for Metals, Metal Park, OH 44073.
Frost, H. J., Lavery, P. R., and Lutender, S. D., 1987, Proc. 3rd Annual Electronic Packaging and Corrosion in Microelectronics Conf., Vol. 3, pp. 259–267.
Snowden,  K. U., 1964, “The Effect of Atmosphere on the Fatigue of Lead,” Acta Metall., 12, pp. 295–303.
Snowden,  K. U., 1966, “Fatigue Crack Formation in Bicrystals of Lead,” Philos. Mag., 14, pp. 1019–1029.
Langdon,  T. G., and Gifkins,  R. C., 1983, “Cyclic Grain Boundary Migration During High Temperature Fatigue—I. Microstructural Observations,” Acta Metall., 31, No. 6, pp. 927–938.
Langdon,  T. G., Simpson,  D., and Gifkins,  R. C., 1983, “Cyclic Grain Boundary Migration During High Temperature Fatigue—II. Measurements of Grain Boundary Sliding,” Acta Metall., 31, No. 6, pp. 939–946.
Betrabet,  H. S., and Raman,  V., 1988, “Microstructural Observations in Cyclically Deformed Pb-Sn Solid Solution Alloy,” Metall. Trans. A, 19, June, pp. 1437–1443.
Berriche, R., Vaynman, S., Fine, M. E., and Jeannotte, D. A., 1987, “Effect of Environment on Fatigue of Low Tin Lead Base Solder,” Proceedings of the 3rd Annual ASME Conference on Electronic Packaging and Corrosion in Microelectronics, M. E. Nicholson, ed., pp. 169–174.
Berriche,  R., Fine,  M. E., and Jeannotte,  D. A., 1991, “Environmental and Hold Time Effects on Fatigue of Low-Tin Lead-Based Solder,” Metall. Trans. A, 22, Feb., pp. 357–366.
Raman,  V., and Reiley,  T. C., 1988, “Cyclic Deformation and Fracture in Pb-Sn Solid Solution Alloy,” Metall. Trans. A, 19A, June, pp. 1533–1546.
Dowling, N. E., and Begley, J. A., 1976, “Fatigue Crack Growth During Gross Plasticity and the J-Integral,” Mechanics of Crack Growth, ASTM STP 590, ASTM, pp. 82–103.
Clarke,  G. A., and Landes,  J. D., 1979, “Evaluation of the J Integral for the Compact Specimen,” J. Test. Eval., 7, No. 5, Sept., pp. 264–269.
Elber,  W., 1970, “Fatigue Crack Closure Uncer Cyclic Tension,” Engineering Fracture Mechanics, 2, pp. 37–45.
Liaw, P. K., 1988, “Overview of Crack Closure at Near-Threshold Fatigue Crack Growth Levels,” Mechanics of Fatigue Crack Closure, ASTM STP 982, J. C. Newman, Jr., and W. Elber, eds., ASTM, Philadelphia, pp. 62–92.
Suresh, S., 1998, Fatigue of Materials, 2nd ed., Cambridge University Press, NY.
Sehitoglu,  H., and Garcia,  A. M., 1997, “Contact of Crack Surfaces During Fatigue: Part 2. Simulations,” Metall. Mater. Trans. A, 28, Nov., pp. 2277–2289.
Broek, D., 1989, The Practical Use of Fracture Mechanics, Kluwer Academic Publishers.
Liaw,  P. K., Leax,  T. R., and Logsdon,  W. A., 1983, “Near-Threshold Fatigue Crack Growth Behavior in Metals,” Acta Metall., 31, pp. 1581–1587.


Grahic Jump Location
Microstructure of the material used
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Load-strain curve measured using the strain gauge attached on side surface during FCG test at R=0.1,f=10 Hz, ΔK=0.52 MPa m1/2
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Effect of stress ratio on the da/dN−ΔJ curve
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Effect of stress ratio on the da/dN−ΔK curve
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Effect of stress ratio on the da/dN−Kmax curve
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Crack tip of main crack (a) and branched crack (b). (R=0.1).
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Cavities and microcracks ahead of crack tip on side surface of tested specimens; (a) R=0.1, which indicates cavities along grain boundary; (b) R=0.7, which indicates microcracks along grain boundary
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Morphology in the crack tip region at the near-threshold region (R=0.7)
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Fractographies of tested specimens
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Microcracks induced by slip marks (arrow A) and striations (arrow B) on fracture surface of R=0.1




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