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TECHNICAL BRIEFS

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

[+] Author and Article Information
Xiangcheng Luo, Yunsheng Xu, D. D. L. Chung

Composite Materials Research Laboratory, State University of New York at Buffalo, Buffalo, NY 14260-4400

J. Electron. Packag 123(3), 309-311 (Jun 26, 2000) (3 pages) doi:10.1115/1.1371925 History: Received June 26, 2000
Copyright © 2001 by ASME
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References

Wolff,  E. G., and Schneider,  D. A., 1998, “Prediction of Thermal Contact Resistance between Polished Surfaces,” Int. J. Heat Mass Transf. 41, No. 22, pp. 3469–3482.
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Lu,  X., Xu,  G., Hofstra,  P. G., and Bajcar,  R. C., 1998, “Moisture-Absorption, Dielectric Relaxation, and Thermal Conductivity Studies of Polymer Composites,” J. Polym. Sci., Part B: Polym. Phys. 36, No. 13, pp. 2259–2265.
Sasaski, T., Hisano, K., Sakamoto, T., Monma, S., Fijmori, Y., Iwasaki, H., and Ishizuka, M., 1995, “Development of Sheet Type Thermal Conductive Compound Using AIN,” Japan IEMT Symp. Proc., IEEE/CPMT Int. Electronic Manufacturing Technology (IEMT) Symp., IEEE, Piscataway, NJ, pp. 236–239.
Xu, Y., Luo, X., and Chung, D. D. L., “Lithium doped polyethylene-glycol-based thermal interface pastes for high thermal contact conductance,” ASME J. Electron. Packag., in press.
Xu,  Y., Luo,  X., and Chung,  D. D. L., 2000, “Sodium Silicate Based Thermal Pastes for High Thermal Contact Conductance,” ASME J. Electron. Packag. 122, No. 2, pp. 128–131.

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