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TECHNICAL BRIEFS

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

[+] Author and Article Information
Xiangcheng Luo, Yunsheng Xu, D. D. L. Chung

Composite Materials Research Laboratory, State University of New York at Buffalo, Buffalo, NY 14260-4400

J. Electron. Packag 123(3), 309-311 (Jun 26, 2000) (3 pages) doi:10.1115/1.1371925 History: Received June 26, 2000
Copyright © 2001 by ASME
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