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PAPERS ON RELIABILITY

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

[+] Author and Article Information
S. Shetty, V. Lehtinen, A. Dasgupta

CALCE Electronic Products and Systems Consortium, University of Maryland, College Park, MD 20742

V. Halkola, T. Reinikainen

Nokia Research Center, Finland, P.O. Box 407, 00045 Nokia Group, Finland

J. Electron. Packag 123(3), 302-308 (Mar 25, 2000) (7 pages) doi:10.1115/1.1362673 History: Received March 25, 2000
Copyright © 2001 by ASME
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References

Lau, J. H., and Pao Y., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies, McGraw Hill, NY.
Lau, J. H., and Lee, Ricky S-W., 1999, Chip Scale Package: Design, Materials Processes and Applications, McGraw Hill, NY.
Schueller R. D., Bradley E. A., and Harvey P. M., 1999, “Meeting the Cost/Performance Requirements of Flex-Based Chip-Scale Packages,” Chip Scale Review, Jan. Feb.
BPA Group Ltd., 1998, “Technology Update No. 3,” p. 2, Feb.
Shetty S., 2000, “Effect Of Cyclic Bending On Chip Scale Package Assemblies,” MS thesis, Dept. of Mechanical Engineering, University of Maryland, College Park.
Coffin,  L. F., 1954, “A Study of the Effect of Cyclic Thermal Stress on a Ductile Metal,” Trans. ASME, 76, pp. 931–950.
Morrow J. D., 1965, “Cyclic Plastic Strain Energy and Fatigue of Metals,” Internal Friction, Damping and Cyclic Plasticity, ASTM-STP, pp. 45–87.
Upadhyayula, K., 1999, “An Incremental Damage Superposition Approach for Surface Mount Electronic Interconnect Durability under Combined Temperature and Vibration Environments,” Ph.D. dissertation, Dept. of Mechanical Engineering, University of Maryland, College Park.

Figures

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Failure mechanisms in CSP
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Moment history for overstress test
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Curvature distribution (fatigue test)
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Experimental fatigue life plot (interconnects on top)
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Three-point bend test setup
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Distribution of moments along the specimen
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Schematic diagram of the fixture
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Schematic diagram of the test specimen
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Chip scale package configuration
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Package footprint (dimensions in mm)
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Cross section of a typically failed specimen
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Experimental fatigue life plot (interconnects on bottom)
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Weibull cumulative distribution plots for interconnects on top surface of the PWB
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Predicted curvature distribution (fatigue test)
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Local finite element model (except col 0)
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Finite element mesh of critical joint
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Equivalent strain contour plot
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Calibration curve (interconnects on top)
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Predicted fatigue plot (interconnects on top)
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Predicted fatigue plot (interconnects on bottom)
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Peeling stresses and equivalent strains histories (top critical solder joint)
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Peeling stresses and equivalent strains histories (bottom critical solder joint)
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Output durability curve

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