0
PAPERS ON RELIABILITY

Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

[+] Author and Article Information
S. H. Fan, Y. C. Chan, J. K. L. Lai

Department of Electronic Engineering and Department of Physics and Materials Science, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong

J. Electron. Packag 123(3), 290-294 (Jul 14, 1999) (5 pages) doi:10.1115/1.1347997 History: Received July 14, 1999
Copyright © 2001 by ASME
Your Session has timed out. Please sign back in to continue.

References

Mammo, E., Mawer, A., Srikantappa, A., Vasan, S., Dody, G., and Burnette, T., 1995, “Solder Joint Reliability Study on Area Array and Peripheral Leaded Packages,” Proceedings of the SMTA National Symposium, Oct., pp. 43–58.
Lee,  S. W., and Lau,  J. H., 1996, “Effect of Chip Dimension and Substrate Thickness on Solder Joint Reliability of Plastic Ball Grid Array Packages,” Circuit World, 23, No. 1, pp. 16–19.
Jung, W., Lau, J. H., and Pao, Y. H., 1996, “Nonlinear Analysis of Full Matrix and Perimeter PBGA Solder Joints,” Proc. of ASME International Mechanical Eng. Congress and Exhibition.
Mustain, H. A., Yasir, A. Q., Hassan, A. Y., and Seetharamu, K. N., 1997, “Thermal-mechanical Stress Analysis of PBGA,” Proceedings of 1st Electronic Packaging Technology Conference, pp. 183–187.
Lau John H., 1991 Solder Joint Reliability: Theory and Application, Van Nostrand Reinhold, NY.
Lau, John H., 1995, “Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibration Conditions,” Proceedings of Japan International Electronic Manufacturing Technology Symposium, Dec., pp. 13–19.
Lau,  J., Gratalo,  K., Schneider,  E., Marcotte,  T., and Baker,  T., 1995, “Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies under Bending, Twisting, and Vibration Conditions,” Circuit World, 22, pp. 27–32.
Wu, Y. P., Chan, Y. C., and Lai, J. K. L., 1998, “Reliability Studies of Plastic Ball Grid Array Assemblies Reflowed in Nitrogen Ambient,” Proceeding of the 48th Electronic Components & Technology Conference, pp. 525–531, May, Seattle, WA.
Yang, S. M., 1997, Fundamentals of Heat Transfer, High Education Press, p. 5, p. 198.
Tu, P. L., Chan, Y. C., Tang, C. W., and Lai, J. K. L., 2000, “Vibration fatigue of μBGA solder joint,” Proceedings of the 50th Electronic Components & Technology Conference, May.
Lau, J. H., 1997, Solder Joint Reliability of BGA, CSP, Flip Chap, and Fine Pitch SMT Assemblies, McGraw-Hill, NY, pp. 29–36.
Frear, D. R., Morgan, H. S., Burcheit, S. N., and Lau, J. H., 1994, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, NY, pp. 42–86, 361–378.
Zakraysek,  L., 1972, “Intermetallic growth in tin-rich solders,” Welding J.: Welding Res. Suppl., 51, pp. 536-s–541-s.
Tu,  K. N., 1973, “Interdiffusion and reaction in bimetallic Cu-Sn thin films,” Acta Metall., 21, pp. 347–354.
Corbin,  J. S., 1993, “Finite Element Analysis of Solder Ball Connect Structural Design Optimization,” IBM J. Res. Dev., 37, pp. 585–596.
Alex,  C., So,  K., and Chan,  Y. C., 1996, “Reliability Studies of Surface Mount Solder Joints-Effect of Cu-Sn Intermetallic Compounds,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 19, No. 3, pp. 661–668.
Tu,  P. L., Chan,  Y. C., and Lai,  J. K. L., 1997, “Effect of Intermetallic Compounds on the Thermal Fatigue of Surface Mount Solder Joints,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 20, No. 1, pp. 87–93.
Mei,  Z., Morris,  J. W., Shine,  M. C., and Summers,  T. S. E., 1991, “Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder joint,” J. Electron. Mater., 20, No. 8, pp. 599–608.
Mei,  Z., and Morris,  J. W., 1992, “Fatigue lives on 60Sn/40Pb solder joints made with different cooling rates,” ASME J. Electron. Packag., 114, pp. 104–108.
Daping,  Yao, and Jian Ku,  Shang, 1996, “Effect of cooling rate on interfacial fatigue-crack growth in Sn-Pb solder joints,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 19, No. 1, pp. 154–165.
Holman, J. P., 1963, Heat Transfer, McGraw-Hill, NY, pp. 150–151.

Figures

Grahic Jump Location
Typical reflow temperature profile measured near the solder (Ts) and in the ambient gas (T), (a) profile #2, (b) profile #4
Grahic Jump Location
Fatigue lifetime (N50percent cycles) versus the mean coefficient of heat transfer (hm W/(m2⋅°C)) at displacement amplitudes of ±0.21 mm and ±0.28 mm, (a) 169-pin samples, (b) 225-pin
Grahic Jump Location
Fatigue lifetime (N50percent) of samples reflowed by profile #4 versus different cycle displacement amplitudes
Grahic Jump Location
The SEM micrographs of the interfacial microstructures for the solder joints reflowed by (a) profile #1, (b) profile #3, (c) profile #5
Grahic Jump Location
SEM cross-sectional view of initial crack near PCB solder pad
Grahic Jump Location
Cross-sectional view (SEM) of crack in a failed solder joint
Grahic Jump Location
Frictional sliding tracks on the solder side fracture surface of solder/IMC interface crack in a failed solder joint
Grahic Jump Location
Schematic of geometry of solder joint array for calculation of the mean coefficient of forced convection heat transfer

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In