The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies

[+] Author and Article Information
Y. P. Wu, P. L. Tu, Yan C. Chan

Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong

J. Electron. Packag 123(3), 284-289 (Jul 07, 1999) (6 pages) doi:10.1115/1.1371782 History: Received July 07, 1999
Copyright © 2001 by ASME
Your Session has timed out. Please sign back in to continue.


Lau, J. H., and Pao, Y., eds., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY.
Lau, J. H., 1995, “Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibration Conditions,” Proceedings of Japan International Electronic Manufacturing Technology Symposium, Dec., pp. 13–19.
Wu, Y. P., Chan, Y. C., and Lai, J. K. L., 1998, “Reliability Studies of Plastic Ball Grid Array Assemblies Reflowed in Nitrogen Ambient,” Proceedings of 48th ECTC Conference, Seattle, USA, May, pp. 292–296.
Mescher,  P., and Phelan,  G., 1993, “A Practical Comparison of Surface Mount Assembly for Ball Grid Array Components,” Journal of Surface Mount Technology,8, Issue 2, pp. 24–29.
Hsiao,  H., Lin,  J. R., Chang,  E. K., and Adams,  S. M., 1998, “Reduction of Solder Defects Under Nitrogen,” Surface Mount Technology, 12. No. 1, Jan., pp. 56–58.
Li,  Y., Mahajan,  R. L., and Subbarayan,  G., 1998, “The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints,” ASME J. Electron. Packag., 120, pp. 54–60.
Renken,  F. P., and Subbarayan,  G., 1998, “A Two-Body Formulation for Solder Joint Shape Prediction,” ASME J. Electron. Packag., 120, pp. 302–308.
Coffin,  L. F., 1954, “A Study of Cyclic Thermal Stresses in a Ductile Metal,” Trans. ASME, 76, p. 931.
Lau, J. H., 1993, Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, New York, pp. 173–222.


Grahic Jump Location
A fracture section microphotograph of fatigue failure for specimen prepared using 0.10 mm stencil
Grahic Jump Location
Profile of cross section area, stress and strain distribution along x-axis
Grahic Jump Location
Thermal shock fatigue life as a function of the stencil thickness
Grahic Jump Location
Bending fatigue life cycle as a function of the stencil thickness
Grahic Jump Location
Cantilever bending fatigue test setup
Grahic Jump Location
SEM fracture section photomicrograph
Grahic Jump Location
Maximum deformation as a function of stencil thickness
Grahic Jump Location
Maximum shear force as a function of stencil thickness
Grahic Jump Location
The temperature profile for the current reflow process
Grahic Jump Location
The geometry specification of the CBGA specimen
Grahic Jump Location
An illustration of a CBGA solder joint
Grahic Jump Location
Photographs of the joints corresponding to the three stencil thickness
Grahic Jump Location
Vibration fatigue life as a function of the stencil thickness




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In