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TECHNICAL PAPERS

Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material

[+] Author and Article Information
Y. Wei, C. L. Chow

Department of Mechanical Engineering, University of Michigan-Dearborn, Dearborn, MI 48128

H. E. Fang, M. K. Neilsen

Sandia National Laboratories, Albuquerque, New Mexico 87185

J. Electron. Packag 123(3), 278-283 (Oct 20, 1999) (6 pages) doi:10.1115/1.1372319 History: Received October 20, 1999
Copyright © 2001 by ASME
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References

Busso,  E. P., Kitano,  M., and Kumazawa,  T., 1992, “A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints,” ASME J. Eng. Mater. Technol., 114, pp. 331–337.
Busso,  E. P., Kitano,  M., and Kumazawa,  T., 1994, “Modeling Complex Inelastic Deformation Processes in IC Packages’ Solder Joints,” ASME J. Electron. Packag., 116, pp. 6–15.
Frear,  D. R., Burchett,  S. N., Neilsen,  M. K., and Stephens,  J. J., 1997, “Microstructurally Based Finite Element Simulation of Solder Joint Behavior,” Soldering & Surface Mount Technology, 2, No. 25, pp. 39–42.
Fu,  C., McDowell,  D. L., and Ume,  I. C., 1998, “A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects,” ASME J. Electron. Packag., 120, pp. 24–34.
Pao, Y.-H., Badgley, S., Govila, R., and Jih, E., 1994, “Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints,” ASTM STP 1153, Fatigue of Electronic Materials, pp. 60–81.
Lemaitre, J., and Chaboche, J. L., 1990, Mechanics of Solid Materials, Cambridge University Press.
Chow,  C. L., and Wang,  J., 1987, “An Anisotropic Theory of Continuum Damage Mechanics for Ductile Fracture,” Eng. Fract. Mech., 27, pp. 547–558.
Chow,  C. L., and Wei,  Y., 1991, “A Model of Continuum Damage Mechanics for Fatigue Fracture,” Int. J. Fract., 50, pp. 301–316.
Chow,  C. L., and Wei,  Y., 1999, “Constitutive Modeling of Material Damage for Fatigue Failure Prediction,” Int. J. Damage Mech., 8, pp. 355–375.
Basaran,  C., Desai,  C. S., and Kundu,  T., 1998, “Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1-Theory and Formulation,” ASME J. Electron. Packag., 120, pp. 41–47.
Hayakawa,  K., and Murakami,  S., 1997, “Thermodynamical Modeling of Elastic-Plastic Damage and Experimental Validation of Damage Potential,” Int. J. Damage Mech., 6, pp. 333–363.
Ju,  S. H., Sandor,  B. I., and Plesha,  M. E., 1996, “Life Prediction of Solder Joints by Damage and Fracture Mechanics,” ASME J. Electron. Packag., 118, pp. 193–200.
Hansen,  N. R., and Schreyer,  H. L., 1994, “A Thermodynamically Consistent Framework for Theories of Elastoplasticity Coupled With Damage,” Int. J. Solids Struct., 31, pp. 359–389.
Krajcinovic,  D., and Fonseka,  G. U., 1981, “The Continuous Damage Mechanics of Brittle Materials, Parts I and II,” ASME J. Appl. Mech., 48, pp. 809–824.
Fang, H. Eliot, Chow, C. L., and Yang, F., 1998 “A Method of Damage Mechanics Analysis for Solder Material,” Fracture and Strength of Solids—Part 2: Behavior of Materials and Structures, pp. 367–374.
Neilsen,  M. K., Burchett,  S. N., Fang,  H. E., and Vianco,  P. T., “Effects of Microstructural Heterogeneity on BGA Reliability,” Sandia National Laboratories Report.
More, J. J., 1978, “The Levenburg-Marquardt Algorithm: Implementation and Theory,” Lecture Notes in Mathematics 630, G. A. Watson, ed., Springer-Verlag.

Figures

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Creep behavior of 60Sn-40Pb for three stress levels
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Specimen Configurations (all unit:mm)
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Undeformed elements at notch area
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Deformed elements at notch area
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Deformed specimen under monotonic tension
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Contours of overall damage at displacement 0.98 mm at loading rate 2.7×10−3 mm/s
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Contours of overall damage at displacement 2.08 mm at loading rate 2.7×10−3 mm/s

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