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TECHNICAL PAPERS

Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material

[+] Author and Article Information
Y. Wei, C. L. Chow

Department of Mechanical Engineering, University of Michigan-Dearborn, Dearborn, MI 48128

H. E. Fang, M. K. Neilsen

Sandia National Laboratories, Albuquerque, New Mexico 87185

J. Electron. Packag 123(3), 278-283 (Oct 20, 1999) (6 pages) doi:10.1115/1.1372319 History: Received October 20, 1999
Copyright © 2001 by ASME
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References

Figures

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Creep behavior of 60Sn-40Pb for three stress levels
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Specimen Configurations (all unit:mm)
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Undeformed elements at notch area
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Deformed elements at notch area
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Deformed specimen under monotonic tension
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Contours of overall damage at displacement 0.98 mm at loading rate 2.7×10−3 mm/s
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Contours of overall damage at displacement 2.08 mm at loading rate 2.7×10−3 mm/s

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