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TECHNICAL PAPERS

Warpage of Plastic IC Packages as a Function of Processing Conditions

[+] Author and Article Information
Dickson T. S. Yeung, Matthew M. F. Yuen

Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

J. Electron. Packag 123(3), 268-272 (Dec 22, 1999) (5 pages) doi:10.1115/1.1349421 History: Received December 22, 1999
Copyright © 2001 by ASME
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References

Nguyen,  L. T., 1993, “Reliability of Postmolded IC Packages,” ASME J. Electron. Packag., 115, pp. 346–355.
Suhir,  E., 1992, “Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices,” ASME J. Electron. Packag., 114, pp. 467–470.
Kiang, B., Wittmershaus, J., Kar, R., and Sugai, N., 1991, “Package Warpage Evaluation For Multi-Layer Molded PQFP,” IEEE/CHMT ’91 IEMT Symposium, pp. 89–93.
Kiang, B., and Jahsman, W. E., 1991, “Mechanical Performance of Thin Plastic Packages,” Manufacturing Processes and Material Challenges in Microelectronic Packaging, EEE-Vol. 1, ASME, pp. 115–123.
Yip, L., and Hamzehdoost, A., 1995, “Package Warpage Evaluation for High Performance PQFP,” 45th ECTC, pp. 229–233.
Song, Y. J., et al., 1995, “Development of 0.5 mm Thick Small Outline Package,” 45th ECTC, pp. 304–309.
Oota, K., and Shigeno, K. 1995, “Development of Molding Compounds for BGA,” 45th Electronic Components Conference, pp. 78–85.
Kelly, G., Lyden, C., Mathuna, C. O., and Campbell, J. S., 1992, “Investigation of Thermo-Mechanically Induced Stress in a PQFP 160 Using Finite Element Techniques,” 42nd Electronic Component Conference, pp. 467–472.
Kelly, G., Lyden, C., Lawton, W., and Barrett, J., 1994, “Accurate Prediction of PQFP Warpage,” 44th Electronic Component Conference, pp. 102–106.
Yeung, T. S., and Yuen, M. M. F., 1996, “Warpage of IC Packages,” The First Asia-Pacific Conference on Materials and Processes in IC Encapsulation, pp. 4-1–4-10.
Yeung, T. S., and Yuen, M. M. F., 1996, “Viscoelastic Analysis of IC Package Warpage,” ASME Sensing, Modeling and Simulation in Emerging Electronic Packaging Symposium, EEP-Vol. 17, pp. 101–107.
Ferry, J. D., 1980, Viscoelastic Properties of Polymers, 3rd Ed., J Wiley, NY.
Yeung, T. S., 1997, Ph.D. Dissertation, HKUST.

Figures

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Degree-of-cure as a function of Tg
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Tg Dependence of α1 and α2
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Quarter finite element model of a PQFP
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Quarter model showing leadframe and die of the package
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Warped package with alloy 42 leadframe
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Warped package with copper leadframe
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Warpage prediction of PQFP with A42 leadframe against processing conditions, (a) Viscoelatic EMC model, (b) Elastic EMC model
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Processing window of warpage prediction
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Warpage measurement, (a) Fixture for measurement, (b) Measured package profile

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