0
TECHNICAL PAPERS

Warpage of Plastic IC Packages as a Function of Processing Conditions

[+] Author and Article Information
Dickson T. S. Yeung, Matthew M. F. Yuen

Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

J. Electron. Packag 123(3), 268-272 (Dec 22, 1999) (5 pages) doi:10.1115/1.1349421 History: Received December 22, 1999
Copyright © 2001 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Degree-of-cure as a function of Tg
Grahic Jump Location
Tg Dependence of α1 and α2
Grahic Jump Location
Quarter finite element model of a PQFP
Grahic Jump Location
Quarter model showing leadframe and die of the package
Grahic Jump Location
Warped package with alloy 42 leadframe
Grahic Jump Location
Warped package with copper leadframe
Grahic Jump Location
Warpage prediction of PQFP with A42 leadframe against processing conditions, (a) Viscoelatic EMC model, (b) Elastic EMC model
Grahic Jump Location
Processing window of warpage prediction
Grahic Jump Location
Warpage measurement, (a) Fixture for measurement, (b) Measured package profile

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In