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TECHNICAL PAPERS

Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

[+] Author and Article Information
Fuqian Yang, Imin Kao

Department of Mechanical Engineering, State University of New York at Stony Brook, Stony Brook, NY 11794

J. Electron. Packag 123(3), 254-259 (Aug 30, 2000) (6 pages) doi:10.1115/1.1348019 History: Received January 27, 1998; Revised August 30, 2000
Copyright © 2001 by ASME
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References

Figures

Grahic Jump Location
A schematic diagram of the “rolling-indenting” process in wiresaw manufacturing process under Free Abrasive Machining (FAM). The size of the abrasive grits is exaggerated for the sake of illustration; hence, the plot is not to scale.
Grahic Jump Location
Schematic of the modeling of interaction between the abrasive particle and substrate surface during the wiresaw manufacturing processes. The model considers the effects of the moving wire and the induced tangential load, Ft, in addition to the normal load, N. The region immediately under the conical abrasive indenter tip is the plastic zone.
Grahic Jump Location
The equivalent representation of the plastic deformation field under indentation and a spherical cavity expanding under internal pressure (Hill 22)
Grahic Jump Location
A comparison of the feed rate for material removal of the “rolling-indenting” and “scratch-indenting” processes in wiresawing under Free Abrasive Machining (FAM). The data, plotted with respect to the load per unit length of the wire, are normalized for the sake of comparison.

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