Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

[+] Author and Article Information
G. Z. Wang, Z. N. Cheng

Daimler Chrysler SIM Technology, 865 Changning Road, Shanghai 200050, China

K. Becker

University of Applied Science Bingen, Bingen 55411, Germany e-mail: becker@fh-bingen.de

J. Wilde

IMTEK, University of Freiburg, Freiburg im Breisgan D-79085, Germany e-mail: wilde@imtek.uni-freiburg.de

J. Electron. Packag 123(3), 247-253 (Oct 20, 1998) (7 pages) doi:10.1115/1.1371781 History: Received October 20, 1998
Copyright © 2001 by ASME
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Grahic Jump Location
Plastic strain hardening data for 60Sn40Pb solder (ε̇=1.0×10−3 s−1 , T=−25°C)
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Stress-strain hysteresis loops of the selected element in solder joints under thermal cycling
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Constant strain rate behavior of 60Sn40Pb solder (×: derived from elasto-plasto-creep model; —: prediction from Anand model)
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Constant strain rate behavior of 62Sn36Pb2Ag solder (×: derived from elasto-plasto-creep model; —: prediction from Anand model)
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Steady-state creep behavior of 60Sn40Pb solder
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Steady-state creep behavior of 96.5Sn3.5Ag solder
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Schematic diagram of a simple specimen
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Distributions of inelastic shear strains in solder joints at start −55°C dwell of the third thermal cycle  



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