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TECHNICAL PAPERS

A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

[+] Author and Article Information
Sarang Shidore

Flomerics Inc., 1106 Clayton Lane, Suite 525W, Austin, TX 78723e-mail: sarang@flomerics.com

Tien Yu Tom Lee

Interconnect Systems Laboratories, Motorola Inc., 2100 E. Elliott road, MD EL 725, Tempe, AZ 85284e-mail: tom.lee@motorola.com

J. Electron. Packag 123(3), 232-237 (Nov 27, 2000) (6 pages) doi:10.1115/1.1349423 History: Received November 27, 2000
Copyright © 2001 by ASME
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References

Dutta, V. B., 1988, “Junction-to-Case Thermal Resistance—Still a Myth?” Proc. 4th IEEE SEMITHERM Symposium, pp. 8–11.
Rosten, H., and Lasance, C. J. M., 1994, “The Development of Libraries of Thermal Models of Electronics Components for an Integrated Design Environment,” Proc. IEPS Conference, pp. 138–147.
Rosten, H., 1996, “DELPHI—A Status Report on the European-funded Project for the Development of Libraries and Physical Models for an Integrated Design Environment,” Proc. Of 46th Electronic Components & Technology Conference, pp. 172–185.
Parry,  J., Rosten,  H., and Kromann,  G., 1996, “The Development of Component-level Thermal Compact Models of a C4/CBGA Interconnect Technology: the Motorola Power PC 603 and Power PC 604 RISC Microprocessors,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A 21, No. 1, pp. 104–112.
Joiner, B. and Adams, V., 1999, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling, Proc. of 15th SEMITHERM, pp. 212–220.
JEDEC MO-163, 1994, Rectangular Plastic Ball Grid Array, 1.27 mm. Pitch.
Shidore, S., and Kromann, G., 1997, “Development of Optimized Component-Level Thermal Behavioral Models of a Plastic Ball Grid Array Interconnect Technology for Air-Cooled Applications,” Proc. of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, INTERpack’97, Vol. 1, pp. 981–988.
FLOPACK User Documentation, 1999, http://www.flopack.com, Flomerics Inc.
FLOTHERM User Documentation, 1999, Flomerics Inc.
Lasance, C. J. M., Hertog, P., and Stehouwer, P., 1999, “Creation and Evaluation of Compact Models for Thermal Characterization Using Dedicated Optimization Software,” Proc. of 15th SEMITHERM, pp. 189–200.
SOLCOND User’s Guide, 1998, Flomerics Inc. Internal Document.

Figures

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Topology of a two-resistance compact model
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Topology of (a) star and (b) shunt compact models
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Cross-sectional view of a typical die-up plastic ball grid array (PBGA) package
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Detailed model of 256 PBGA (a) isometric view and (b) side view
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Two-resistance models for 256 PBGA derived from (a) computational cold plate test, and (b) DELPHI optimization method (numerical values are resistors in K/W)
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Star compact model for 256 PBGA derived using the DELPHI optimization method
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Shunt compact model for the 256 PBGA derived using the DELPHI optimization method (numerical values are resistors in K/W)
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Detailed model validation
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Error in detailed model
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Performance of two-resistor models
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Error in two-resistor models
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Performance of star and shunt models
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Error in star and shunt models

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